Laser-assisted ultrathin die packaging: Insights from a process study

Microelectronic Engineering

Volumn 101, Issue , 2013, Pages 23-30

  Marinov, Val R ^a   Swenson, Orven ^a   Atanasov, Yuriy ^a   Schneck, Nathan ^a  

^a NORTH DAKOTA STATE UNIVERSITY   (United States)

Author keywords

Advanced packaging of bare dice; Laser assisted die transfer; Ultrathin bare die

Indexed keywords

ADHESIVE LAYERS; ADVANCED PACKAGING; BARE DIES; CONSUMABLE MATERIALS; DIE PACKAGING; DIE PLACEMENT; FLEXIBLE ELECTRONIC DEVICES; LASER PROCESS; LASER-ASSISTED; LOW COSTS; PULSE PARAMETER; THERMO-MECHANICAL; TRANSFER RATES; ULTRA-SMALL; ULTRA-THIN; WAFER DICING;

MECHANICAL PROPERTIES; PACKAGING; SILICON WAFERS;

DIES;

EID: 84866839745     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2012.08.016     Document Type: Article

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