Noncontact selective laser-assisted placement of thinned semiconductor dice

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 6, 2012, Pages 971-978

  Miller, Ross ^a   Marinov, Val ^a   Swenson, Orven ^b   Chen, Zhigang ^c   Semler, Matt ^a  

^a North Dakota State University   (United States)

^b NORTH DAKOTA STATE UNIVERSITY   (United States)

^c ASHLAND INC   (United States)

Author keywords

Embedded chips; flexible electronics; laser induced forward transfer (LIFT); ultrathin semiconductor die

Indexed keywords

ASSEMBLY TECHNIQUES; DISRUPTIVE TECHNOLOGY; EMBEDDED CHIPS; LASER-ASSISTED; LASER-INDUCED FORWARD TRANSFER; NON-CONTACT; PICK-AND-PLACE; PLACEMENT METHODS; THERMO-MECHANICAL; TRANSFER PROCESS; ULTRA-THIN; UV LASER PULSE;

DIES; FLEXIBLE ELECTRONICS; MASS TRANSFER;

SEMICONDUCTOR LASERS;

EID: 84861946788     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2183594     Document Type: Article

References (40)

1. J. W. Balde, Foldable Flex and Thinned Silicon Multichip Packaging Technology. New York: Springer-Verlag, 2003.
2. J. N. Burghartz, Ultrathin Chip Technology and Applications. New York: Springer-Verlag, 2010.
3. K. Y. Chen, R. L. D. Zenner, M. Ameson, and D. Mountain, "Ultrathin electronic device package," IEEE Trans. Adv. Packag., vol. 23, no. 1, pp. 22-26, Feb. 2000.
4. B. Holland, R. Mcpherson, Z. T. Zhang, R. Dean, R. W. Johnson, L. D. Castillo, and A. Moussessian, "Ultrathin, flexible electronics," in Proc. 58th Electron. Compon. Technol. Conf., San Diego, CA, 2008, pp. 1110-1116.
5. T. Zhang, Z. Hou, R. W. Johnson, L. D. Castillo, A. Moussessian, R. Greenwell, and B. J. Blalock, "Flexible electronics: Thin silicon die on flexible substrates," IEEE Trans. Electron. Packag. Manuf., vol. 32, no. 4, pp. 291-300, Oct. 2009.
6. W. Christiaens, T. Loeher, B. Pahl, M. Feil, B. Vandevelde, and J. Vanfleteren, "Embedding and assembly of ultrathin chips in multilayer flex boards," Circuit World, vol. 34, no. 3, pp. 3-8, 2008.
7. C. Banda, R. W. Johnson, T. Zhang, Z. Hou, and H. K. Charles, "Flip chip assembly of thinned silicon die on flex substrates," IEEE Trans. Electron. Packag. Manuf., vol. 31, no. 1, pp. 1-8, Jan. 2008. (Pubitemid 351266671)
8. E. Parton, W. Christiaens, and J. Vanfleteren, "Embedded chips redefine miniaturization," Printed Circuit Design Fabricat., vol. 26, p. 37, Jul. 2009.
9. V. Marinov and S. Bhattacharya, "High-density ptf-inlaid traces on flexible substrates," presented at Advanced Technology Workshop on Printed Devices & Applications, Orlando, FL, 2009.
10. K. Gilleo, Area Array Packaging Processes. New York: McGraw-Hill, 2003.
11. T. Harder and W. Reinert, "Low-profile and flexible electronic assemblies using ultrathin silicon-The European FLEX-SI project," in Foldable Flex and Thinned Silicon Multichip Packaging Technology, J. W. Balde, Ed. Boston, MA: Kluwer, 2003.
12. L. Boettcher, "Chip embedding by chip in polymer technology," in Proc. Device Packag. Conf., Scottsdale, AZ, Mar. 2007, pp. 1-10.
13. L. Boettcher, D. Manessis, A. Ostmann, S. Karaszkiewicz, and H. Reichl, "Embedding of chips for system in package realizationtechnology and applications," in Proc. 3rd Int. Microsyst., Packag., Assem. Circuits Technol. Conf., 2008, pp. 383-386.
14. A. Piquéa, S. A. Mathewsb, B. Pratapa, R. C. Y. Auyeunga, B. J. Karnsa, and S. Lakeouc, "Embedding electronic circuits by laser direct-write," Microelectron. Eng., vol. 83, nos. 11-12, pp. 2527-2533, Nov.-Dec. 2006.
15. M. Feil, C. Adler, D. Hemmetzberger, M. Konig, and K. Bock, "The challenge of ultrathin chip assembly," in Proc. 54th Electron. Compon. Technol. Conf., vol. 1. Jun. 2004, pp. 35-40.
16. M. Mastrangeli, S. Abbasi, C. Varel, C. V. Hoof, J.-P. Celis, and K. F. Böhringer, "Self-Assembly from milli-To nanoscales: Methods and applications," J. Micromech. Microeng., vol. 19, no. 8, p. 83001, Jul. 2009.
17. F. Arai, D. Andou, and T. Fukuda, "Adhesion forces reduction for micro manipulation based on micro physics," in Proc. IEEE Workshop Microelectromech. Syst., San Diego, CA, Feb. 1996, pp. 354-359.
18. R. S. Fearing, "Survey of sticking effects for micro parts handling," in Proc. Int. Intell. Robots Syst., Human Robot Interact. Cooperat. Robots, vol. 2. Pittsburgh, PA, 1995, pp. 212-217.
19. B. Pahl and C. Kallmayer, "Ultrathin assemblies on flexible substrates," in Proc. 7th Electron. Packag. Technol. Conf., Singapore, Dec. 2005, p. 6.
20. R. A. Miller, "Thermo-mechanical selective laser assisted die transfer," M.S. thesis, Dept. Electr. Comput. Eng., North Dakota State University, Fargo, 2011.
21. V. R. Marinov, O. F. Swenson, M. Pavicic, R. A. Miller, Z. Chen, F. Sarwar, and M. Semler, "Selective laser-Assisted transfer of discreet components," U.S. Patent 61 473 988, 2011.
22. C. Narayan, S. Purushothaman, F. Doany, and A. Deutsch, "Thin film transfer process for low cost MCM-D fabrication," IEEE Trans. Syst., Man, Cybern. B, Cybern., vol. 18, no. 1, pp. 42-46, Feb. 1995.
23. A. Holmes, "Laser processes for MEMS manufacture," RIKEN Rev., vol. 43, no. 43, pp. 63-69, 2002.
24. A. Holmes and S. Saidam, "Sacrificial layer process with laser-driven release for batchassembly operations," J. Microelectromech. Syst., vol. 7, no. 4, pp. 416-422, Dec. 1998. (Pubitemid 128594633)
25. N. S. Karlitskaya, D. F. de Lange, R. Sanders, and J. Meijer, "Study of laser die release by Q-switched Nd: YAG laser pulses," in Proc. High-Power Laser Ablation V, Taos, NM, 2004, pp. 935-943. (Pubitemid 40103380)
26. N. Karlitskaya, D. F. de Lange, and H. Kettelarij, "Laser propulsion of microelectronic components: Releasing mechanism investigation," in Proc. High-Power Laser Ablation VI, Taos, NM, 2006, pp. 1-10.
27. A. Piqué, S. A. Mathews, B. Pratap, and R. C. Auyeung, "Laser forward transfer of semiconductor devices," in Proc. Symp. Laser Precis. Microfabricat., Williamsburg, VA, 2005, pp. 400-412.
28. A. Piqué, "Use of laser direct-write in microelectronics assembly," J. Laser Micro/Nanoeng., vol. 2, no. 1, pp. 103-107, 2007.
29. A. Piqué, H. Kim, and C. B. Arnold, "Laser forward transfer of electronic and power generating materials," in Laser Ablation Applications, C. Phipps, Ed. New York: Springer-Verlag, 2007, pp. 339-373.
30. A. Piqué, B. Pratap, S. A. Mathews, B. J. Karns, R. C. Auyeung, M. Kasser, M. Ollinger, H. Kim, S. Lakeou, and C. B. Arnold, "Laser direct-write of embedded electronic components and circuits," in Proc. Photon Microelectron. Photon. IV, San Jose, CA, 2005, p. 223.
31. J. R. Sheats, "Printing silicon integrated circuits," in Proc. Printed Electron., San Jose, CA, 2008, pp. 2-5.
32. R. Fabbro, J. Fournier, P. Ballard, D. Devaux, and J. Virmont, "Physical study of laser-produced plasma in a confined geometry," J. Appl. Phys., vol. 68, no. 2, pp. 775-784, Jul. 1990.
33. R. D. Griffin, B. L. Justus, A. J. Campillo, and L. S. Goldberg, "Interferometric studies of the pressure of a confined laser-heated plasma," J. Appl. Phys., vol. 59, no. 6, pp. 1968-1971, Mar. 1985.
34. A. D. Zweig and T. F. Deutsch, "Shock waves generated by confined XeCl excimer laser ablation of polyimide," Appl. Phys. B, vol. 54, no. 1, pp. 76-82, 1992.
35. E. S. Handy, J. M. Kunze, and P. T. Kazlas, "Laser transfer article and method of making," U.S. Patent 7 423 286, Sep. 2004.
36. S. S. Ahmad, "Electronics and materials for flexible sensors and transponders-I," NDSU/CNSE, Fargo, Final Rep. H94003-08-2-0805, 2009.
37. M. S. Brown, N. T. Kattamis, and C. B. Arnold, "Time-resolved study of polyimide absorption layers for blister-Actuated laser-induced forward transfer," J. Appl. Phys., vol. 107, no. 8, pp. 083103-1-083103-8, Apr. 2010.
38. J. H. Brannon, J. R. Lankard, A. I. Baise, F. Burns, and J. Kaufman, "Excimer laser etching of polyimide," J. Appl. Phys., vol. 58, no. 5, pp. 2036-2043, Sep. 1985.
39. C. M. Jefferson and J. A. Hoffnagle. Aspheric Laser Beam Reshaper Applications Guide [Online]. Available: http://www.newport.com/images/ webDocuments-EN/images/11976.PDF
40. V. Marinov, O. Swenson, R. Miller, F. Sarwar, Y. Atanasov, M. Semlar, and S. Datta, "Laser-enabled advanced packaging of ultrathin bare dice in flexible substrates," IEEE Trans. Compon. Packag. Technol., vol. PP, no. 1, p. 1, Dec. 2011.