Wafer thinning techniques for ultra-thin wafers

Advanced Packaging

Volumn 12, Issue 3, 2003, Pages 29-33

  Reiche, Manfred ^a   Wagner, Gerald ^b  

^a MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

^b SEZ AG   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; DRY ETCHING; SILICON WAFERS; TRANSMISSION ELECTRON MICROSCOPY; X RAY ANALYSIS;

ULTRA-THIN WAFERS;

ELECTRONICS PACKAGING;

EID: 0037351301     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (0)