Why are silicon wafers as thick as they are?

Ultra-thin Chip Technology and Applications

Volumn , Issue , 2011, Pages 3-12

  Stallhofer, Peter ^a  

^a SILTRONIC AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84867574889     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-1-4419-7276-7_1     Document Type: Chapter

References (6)

1. Moore GE (1965) Cramming more components onto integrated circuits. Electronics 38(8):114-117
2. http://www.itrs.net/links/2009ITRS/Home2009.htm
3. Kanda T, Fujiwara T, Takaishi K (12 Jan 2008) SUMCO. Semiconductor International
4. http://ismi.sematech.org/meetings/archives/ngf450/index.htm
5. Huff HR, Fabry L, Kishino S (eds) (2002) Semiconductor silicon 2002, vol 1 and 2. The Electrochemical Society, Inc., Pennington, NJ
6. Scheel HJ, Fukuda T (eds) (2003) Crystal growth technology. Wiley, New York