Study of damage and stress induced by backgrinding in Si wafers

Semiconductor Science and Technology

Volumn 18, Issue 4, 2003, Pages 261-268

  Chen, Jian ^a   De Wolf, Ingrid ^b  

^a Melexis   (Belgium)

^b IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS FILMS; CALCULATIONS; DRY ETCHING; MATHEMATICAL MODELS; POLYCRYSTALLINE MATERIALS; PROFILOMETRY; RAMAN SPECTROSCOPY; STRESS ANALYSIS; THIN FILMS;

BACKGRINDING PROCESS; LASER PROFILOMETER; SUBSURFACE DAMAGE;

SILICON WAFERS;

EID: 0037395696     PISSN: 02681242     EISSN: None     Source Type: Journal    
DOI: 10.1088/0268-1242/18/4/311     Document Type: Article

References (7)

1. Pei Z J webpage http://chetah.imse.ksu.edu/~zpei/ultrasonic_machining/wafergrinding/tutorial/ ssd.htm
2. Halahan P and Schraub T Backgrinding technologies for thin-wafer production webpage http://www.chipscalereview.com/issues/0102/f6-01.html
3. De Wolf I 1996 Micro-Raman spectroscopy to study local mechanical stress in silicon integrated circuits Semicond. Sci. Technol. 11 39-54
4. Göttsching H C L and Neß C Two-dimensional characterisation on the surface of paper with reference to its printability webpage http://www.ind.tno.nl/en/cost-action-e11/Printability/printability%20-%20ifp1.p df
5. De Wolf I et al (ed) 1998 Raman and luminescence spectroscopy for microelectronics. Catalogue of optical and physical parameters, 'Nostradamus' project SMT4-CT-95-2024, EUR 18595
6. Stoney G G 1909 Proc. R. Soc. A 82 172
7. Chen J and De Wolf I 2002 Raman spectroscopy as a stress sensor in packaging: correct formulae for different sample surfaces Proc. 52nd Electronic Components and Technology Conference (ECTC) (San Diego, CA)