Grinding-and-slicing technique as an advanced technology for silicon wafer slicing

Machining Science and Technology

Volumn 1, Issue 1, 1997, Pages 33-47

  Tonshoff H K ^a   Karpuschewski, B ^a   Hartmann, M ^b   Spengler, C ^a  

^a LEIBNIZ UNIVERSITY HANNOVER   (Germany)

^b Johann A Krause Maschinenfabrik G   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC EMISSIONS; COST EFFECTIVENESS; GRINDING (MACHINING); GRINDING MACHINES; MICROELECTRONIC PROCESSING; SAWING; WEAR OF MATERIALS;

GRINDING AND SLICING TECHNIQUE; RADIAL CONCENTRICITY ERROR; TOOL WEAR;

SILICON WAFERS;

EID: 0031197397     PISSN: 10910344     EISSN: None     Source Type: Journal    
DOI: 10.1080/10940349708945636     Document Type: Article

References (15)

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