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Journal of Electronic Materials

Volumn 38, Issue 12, 2009, Pages 2429-2435

Heterogeneous intragranular inelastic behavior of a Sn-Ag-Cu alloy

(4) Gong, Jicheng a Conway, Paul P b Liu, Changqing b Silberschmidt, Vadim V b

a UNIVERSITY OF OXFORD (United Kingdom)

b LOUGHBOROUGH UNIVERSITY (United Kingdom)

Author keywords

Dislocations; Lead free solder; Micromechanical testing; Sn Ag Cu

Indexed keywords

FOCUSED-ION-BEAM SYSTEM; HETEROGENEOUS DEFORMATION; INELASTIC BEHAVIOR; INSTRON; INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS; MATRIX; MECHANICAL BEHAVIOR; MICRO-MECHANICAL TESTING; ROOM TEMPERATURE; SHEARING DEFORMATION; SN-AG-CU; SN-AG-CU ALLOY; SNAGCU SOLDER; SUBGRAIN BOUNDARIES; SUBGRAINS; TENSILE TESTS;

CERIUM ALLOYS; DEFORMATION; INTERMETALLICS; LEAD; SILVER ALLOYS; SOLDERING ALLOYS; TENSILE TESTING; TIN ALLOYS;

TIN;

EID: 72549114812 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0871-7 Document Type: Article

Times cited : (3)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.