Recrystallization behaviour of SnAgCu solder joints

Materials Science and Engineering: A

Volumn 474, Issue 1-2, 2008, Pages 201-207

  Sundelin, Janne J ^a   Nurmi, Sami T ^b   Lepistö, Toivo K ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

^b VTI Technologies Oy   (Finland)

Author keywords

Grain; Recrystallization; SnAgCu; Solder; Tin

Indexed keywords

CREEP; EUTECTICS; FATIGUE OF MATERIALS; FRACTURE; NUCLEATION; RECRYSTALLIZATION (METALLURGY); STRAIN; TIN ALLOYS;

INTERGRANULAR FRACTURE; ISOTHERMAL CREEP; THERMOMECHANICAL FATIGUE;

SOLDERED JOINTS;

CREEP; EUTECTICS; FATIGUE OF MATERIALS; FRACTURE; NUCLEATION; RECRYSTALLIZATION (METALLURGY); SOLDERED JOINTS; STRAIN; TIN ALLOYS;

EID: 37649003644     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.04.013     Document Type: Article

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