Microstructural evolution in lead-free solder alloy: Part II. Directionally solidified Sn-Ag-Cu, Sn-Cu and Sn-Ag

Journal of Materials Research

Volumn 19, Issue 5, 2004, Pages 1425-1431

  Allen, Sarah L ^a   Notis, Michael R ^a   Chromik, Richard R ^a   Vinci, Richard P ^a   Lewis, Daniel J ^b   Schaefer, Robert ^b  

^a Lehigh University   (United States)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ANNEALING; COPPER; DIFFUSION; EUTECTICS; METALLOGRAPHIC MICROSTRUCTURE; PHASE COMPOSITION; PROCESS CONTROL; REACTION KINETICS; SOLDERING ALLOYS; SOLIDIFICATION; SYSTEMS (METALLURGICAL);

COARSENING; LEAD FREE SOLDER ALLOYS; MICROSTRUCTURAL EVOLUTION; RATE CONTROLLING MECHANISM; THREE PAHSE EUTECTIC; TIN SILVER COPPER EUTECTIC;

TIN ALLOYS;

EID: 3142733011     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2004.0191     Document Type: Article

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