Accelerating the effects of aging on the reliability of lead free solder joints in a quantitative fashion

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 398-405

  Venkatadri, Vikram ^a   Yin, Liang ^b   Xing, Yan ^c   Cotts, Eric ^c   Srihari, K ^a   Borgesen, Peter ^a,b  

^a State University of New York   (United States)

^b Unovis Solutions   (United States)

^c BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATED TESTING; ACCELERATION FACTORS; AGING TEMPERATURES; AGING TIME; BEFORE AND AFTER; FATIGUE RESISTANCE; HIGHER TEMPERATURES; ISOTHERMAL AGING; LEAD-FREE; LEAD-FREE ALLOY; LEAD-FREE SOLDER JOINT; LONG TERM SERVICE; LONG-TERM GOALS; PAD SIZES; QUANTITATIVE ASSESSMENTS; ROOM TEMPERATURE PROPERTIES; SN-3.0AG-0.5CU; SOLDER JOINTS; SOLDER MASK DEFINED; SOLDER VOLUME;

COPPER ALLOYS; MECHANICAL TESTING; MICROSTRUCTURE; SHEAR STRENGTH; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; SURFACE TREATMENT; TIN; TIN ALLOYS;

LEAD;

EID: 70349693675     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074045     Document Type: Conference Paper

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