Isothermal fatigue behavior of the near-eutectic Sn-Ag-Cu alloy between -25°C and 125°C

Journal of Electronic Materials

Volumn 36, Issue 2, 2007, Pages 173-178

  Korhonen, Tia Marje K ^a   Lehman, Lawrence P ^b   Korhonen, Matt A ^a   Henderson, Donald W ^c  

^a School of Operations Research and Industrial Engineering   (United States)

^b State University of New York   (United States)

^c IBM   (United States)

Author keywords

Crack nucleation and growth; Fatigue microstructure; Isothermal fatigue; Lead free solder; Sn Ag Cu (SAC) alloy

Indexed keywords

CRACK NUCLEATION; FATIGUE MICROSTRUCTURE; ISOTHERMAL FATIGUE; THERMOMECHANICAL CYCLING;

BALL GRID ARRAYS; CRACK PROPAGATION; EUTECTICS; FATIGUE OF MATERIALS; FATIGUE TESTING; GRAIN BOUNDARIES; NUCLEATION; SCANNING ELECTRON MICROSCOPY; SOLDERING; STRESS RELAXATION;

TIN ALLOYS;

EID: 33947596419     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0048-6     Document Type: Article

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