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Volumn 36, Issue 9, 2007, Pages 1111-1120

Damage produced in solder alloys during thermal cycling

Author keywords

Anisotropy of tin; Cracks; Fatigue; Lead free solders; Thermal cycling

Indexed keywords

DAMAGE ACCUMULATION; FREESTANDING SAMPLES; LEAD-FREE SOLDERS;

EID: 34548232313     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0122-8     Document Type: Article
Times cited : (16)

References (20)
  • 5
    • 0142192603 scopus 로고
    • ed. J.H. Lau (New York: Van Nostrand Reinhold)
    • S. Vaynman, and M.E. Fine, in Solder Joint Reliability, ed. J.H. Lau (New York: Van Nostrand Reinhold, 1991), pp. 334-360
    • (1991) Solder Joint Reliability , pp. 334-360
    • Vaynman, S.1    Fine, M.E.2
  • 13
    • 0028738024 scopus 로고
    • Fatigue of electronic materials
    • ed. S.A. Schroeder (Philadelphia)
    • Y.H. Pao, S. Badgley, R. Govila, and E. Jih, Fatigue of Electronic Materials, ASTM STP 1153, ed. S.A. Schroeder (Philadelphia, 1994), pp. 60-81
    • (1994) ASTM STP , vol.1153 , pp. 60-81
    • Pao, Y.H.1    Badgley, S.2    Govila, R.3    Jih, E.4
  • 19
    • 34548216317 scopus 로고    scopus 로고
    • ed. J.R. Davis (Materials Park, OH: ASM International)
    • Metals Handbook, 2nd ed., ed. J.R. Davis (Materials Park, OH: ASM International, 1998), p. 94
    • (1998) Metals Handbook, 2nd Ed. , pp. 94


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.