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Volumn 36, Issue 9, 2007, Pages 1111-1120
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Damage produced in solder alloys during thermal cycling
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Author keywords
Anisotropy of tin; Cracks; Fatigue; Lead free solders; Thermal cycling
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Indexed keywords
DAMAGE ACCUMULATION;
FREESTANDING SAMPLES;
LEAD-FREE SOLDERS;
CRACKS;
DAMAGE DETECTION;
OPTICAL ANISOTROPY;
STRAIN RATE;
STRUCTURAL INTEGRITY;
THERMAL CYCLING;
SOLDERING ALLOYS;
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EID: 34548232313
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-007-0122-8 Document Type: Article |
Times cited : (16)
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References (20)
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