Recrystallization of lead free solder joints - confounding the interpretation of accelerated thermal cycling results?

ASME International Mechanical Engineering Congress and Exposition, Proceedings

Volumn 5, Issue , 2010, Pages 319-326

  Mayyas, Ahmad ^a   Yin, Liang ^a,b   Borgesen, Peter ^a  

^a State University of New York   (United States)

^b UNIVERSAL INSTRUMENTS CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; FAILURE (MECHANICAL); FATIGUE DAMAGE; LEAD-FREE SOLDERS; RECRYSTALLIZATION (METALLURGY); SOLDERED JOINTS; TEXTURES; THERMAL EXPANSION;

ACCELERATED TESTING; ACCELERATED THERMAL CYCLING; DAMAGE MECHANISM; DIFFERENT DAMAGES; LEAD-FREE SOLDER JOINT; RECRYSTALLISATION; RELIABILITY ENGINEERS; SERVICE CONDITIONS; THERMAL EXCURSION; THERMAL EXPANSION MISMATCH;

THERMAL CYCLING;

EID: 77954282803     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2009-12749     Document Type: Conference Paper

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