High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni(P) metallization

Journal of Alloys and Compounds

Volumn 425, Issue 1-2, 2006, Pages 191-199

  Sun, Peng ^a,c   Andersson, Cristina ^c   Wei, Xicheng ^a   Cheng, Zhaonian ^c   Shangguan, Dongkai ^b   Liu, Johan ^a,c  

^a SHANGHAI UNIVERSITY   (China)

^b FLEXTRONICS INTERNATIONAL   (United States)

^c CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

Electroless Ni(P); Interfacial reaction; Intermetallic compound (IMC); Lead free solder

Indexed keywords

ETCHING; HIGH TEMPERATURE EFFECTS; SOLDERING; SURFACE CHEMISTRY; TERNARY SYSTEMS; TIN ALLOYS;

ELECTROLESS METALLIZATION; HIGH TEMPERATURE STORAGE (HTS); INTERFACIAL REACTIONS; KIRKENDALL EFFECTS; LEAD FREE SOLDERS; TERNARY INTERFACIAL COMPOUNDS; THERMAL AGING;

INTERMETALLICS;

EID: 33750483823     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.01.080     Document Type: Article

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