Effects of Co addition on bulk properties of Sn-3.5Ag solder and interfacial reactions with Ni-P UBM

Journal of Electronic Materials

Volumn 38, Issue 1, 2009, Pages 39-45

  Kim, Dong Hoon ^a   Cho, Moon Gi ^a   Seo, Sun Kyoung ^a   Lee, Hyuck Mo ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Co addition; Intermetallic compounds; Microhardness; Pb free solder; Spalling phenomenon; Undercooling

Indexed keywords

BULK PROPERTIES; BUMP METALLURGIES; CO ADDITION; HARDNESS VALUES; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; MORPHOLOGICAL CHANGES; OPTIMUM LEVELS; PB-FREE SOLDER; TERNARY COMPOUNDS;

BRAZING; COBALT COMPOUNDS; INTERMETALLICS; LEAD; LEAD ALLOYS; LEAD COMPOUNDS; MICROHARDNESS; MICROSTRUCTURE; NICKEL; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; SPALLING; UNDERCOOLING; WELDING;

TIN;

EID: 57649238685     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0529-x     Document Type: Conference Paper

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