SCOPUS 정보 검색 플랫폼

Volumn 39, Issue 12, 2010, Pages 2598-2604

Effects of Zn-containing flux on Sn-3.5Ag soldering with an electroless Ni-P/Au surface finish: Microstructure and wettability

(8) Sakurai, Hitoshi a,b Baated, Alongheng a Lee, Kiju a Kim, Seongjun a Kim, Keun Soo a Kukimoto, Youichi b Kumamoto, Seishi b Suganuma, Katsuaki a

a OSAKA UNIVERSITY (Japan)

b Harima Chemicals Inc (Japan)

Author keywords

electroless nickel phosphorus; Flux; intermetallic compounds; Sn Ag solder

Indexed keywords

ELECTROLESS NI; ELECTROLESS NICKEL-PHOSPHORUS; IMC LAYER; INTERFACIAL INTERMETALLICS; INTERFACIAL MICROSTRUCTURE; INTERFACIAL REACTION LAYER; INTERMETALLIC COMPOUNDS; INTERMETALLIC LAYER; JOINT INTERFACES; MOLTEN SOLDERS; NI CONTENT; NI DIFFUSION; QUALITATIVE ANALYSIS; SN-3.5AG; SN-AG SOLDER; SURFACE FINISHES;

ELECTRON PROBE MICROANALYSIS; FINISHING; INTERMETALLICS; MICROSTRUCTURE; PHOSPHORUS; SILVER; SOLDERING; SOLDERING ALLOYS; ZINC; ZINC COMPOUNDS;

TIN;

EID: 78049510653 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-010-1344-8 Document Type: Conference Paper

Times cited : (9)

References (28)

1
- 0040842774
- K Suganuma 2001 Curr. Opin. Solid State Mater. Sci. 5 555
- (2001) Curr. Opin. Solid State Mater. Sci. , vol.5 , pp. 555
- Suganuma, K.¹

2
- 0029481648
- 1:CAS:528:DyaK28XosVSisw%3D%3D
- K Suganuma Y Nakamura 1995 J. Jpn. Inst. Met. 59 1299 1:CAS:528:DyaK28XosVSisw%3D%3D
- (1995) J. Jpn. Inst. Met. , vol.59 , pp. 1299
- Suganuma, K.¹ Nakamura, Y.²

3
- 51649134186
- 1:CAS:528:DyaK2cXltl2hs78%3D 10.1007/BF02651365 1994JEMat.23.721V
- PT Vianco KL Ericson PL Hopkins 1994 J. Electron. Mater. 23 721 1:CAS:528:DyaK2cXltl2hs78%3D 10.1007/BF02651365 1994JEMat..23..721V
- (1994) J. Electron. Mater. , vol.23 , pp. 721
- Vianco, P.T.¹ Ericson, K.L.² Hopkins, P.L.³

4
- 51249164221
- 1:CAS:528:DyaK2cXltl2hsrY%3D 10.1007/BF02651371 1994JEMat.23.765Y
- W Yang RW Messler 1994 J. Electron. Mater. 23 765 1:CAS:528: DyaK2cXltl2hsrY%3D 10.1007/BF02651371 1994JEMat..23..765Y
- (1994) J. Electron. Mater. , vol.23 , pp. 765
- Yang, W.¹ Messler, R.W.²

5
- 0343209109
- ASME New York, NY
- Z. Mei, P. Gallery, D. Fisher, F. Hua, and J. Glazer, Advances in Electronic Packaging-1997 (New York, NY: ASME, 1997), pp. 1543-1550.
- (1997) Advances in Electronic Packaging-1997 , pp. 1543-1550
- Mei, Z.¹ Gallery, P.² Fisher, D.³ Hua, F.⁴ Glazer, J.⁵

6
- 42449132346
- Osaka: Japan Institute of Electronics Packaging
- S. Sakatani, Y. Kohara, T. Saeki, K. Uenishi, and K.F. Kobayashi, 12th Symposium on Microelectronics (Osaka: Japan Institute of Electronics Packaging, 2002), pp. 127-130.
- (2002) 12th Symposium on Microelectronics , pp. 127-130
- Sakatani, S.¹ Kohara, Y.² Saeki, T.³ Uenishi, K.⁴ Kobayashi, K.F.⁵

7
- 42449131095
- Osaka: Japan Institute of Electronics Packaging
- T. Hiramori, M. Ito, M. Yoshikawa, A. Hirose, and K.F. Kobayashi, 12th Symposium on Microelectronics (Osaka: Japan Institute of Electronics Packaging, 2002), pp. 131-134.
- (2002) 12th Symposium on Microelectronics , pp. 131-134
- Hiramori, T.¹ Ito, M.² Yoshikawa, M.³ Hirose, A.⁴ Kobayashi, K.F.⁵

8
- 0036698810
- 1:CAS:528:DC%2BD38Xnt1ehu7w%3D 10.2320/matertrans.43.1840
- Y Chonan T Komiyama J Onuki R Uraao T Kimura T Nagano 2002 Mater. Trans. 43 1840 1:CAS:528:DC%2BD38Xnt1ehu7w%3D 10.2320/matertrans.43.1840
- (2002) Mater. Trans. , vol.43 , pp. 1840
- Chonan, Y.¹ Komiyama, T.² Onuki, J.³ Uraao, R.⁴ Kimura, T.⁵ Nagano, T.⁶

9
- 0036872076
- 1:CAS:528:DC%2BD3sXhs1Cltg%3D%3D
- N Torazawa S Arai Y Takase K Sasaki H Saka 2002 J. Jpn. Inst. Met. 66 1122 1:CAS:528:DC%2BD3sXhs1Cltg%3D%3D
- (2002) J. Jpn. Inst. Met. , vol.66 , pp. 1122
- Torazawa, N.¹ Arai, S.² Takase, Y.³ Sasaki, K.⁴ Saka, H.⁵

10
- 0242721258
- 1:CAS:528:DC%2BD3sXovFWmtLw%3D 10.1557/JMR.2003.0354 2003JMatR.18.2540H
- CW Hwang K Suganuma M Kiso S Hashimoto 2003 J. Mater. Res. 18 2540 1:CAS:528:DC%2BD3sXovFWmtLw%3D 10.1557/JMR.2003.0354 2003JMatR..18.2540H
- (2003) J. Mater. Res. , vol.18 , pp. 2540
- Hwang, C.W.¹ Suganuma, K.² Kiso, M.³ Hashimoto, S.⁴

11
- 7044228178
- 1:CAS:528:DC%2BD2cXosVymsLg%3D 10.1007/s11664-004-0123-9 2004JEMat.33.1200H
- CW Hwang K Suganuma M Kiso S Hashimoto 2004 J. Electron. Mater. 33 1200 1:CAS:528:DC%2BD2cXosVymsLg%3D 10.1007/s11664-004-0123-9 2004JEMat..33.1200H
- (2004) J. Electron. Mater. , vol.33 , pp. 1200
- Hwang, C.W.¹ Suganuma, K.² Kiso, M.³ Hashimoto, S.⁴

12
- 33846449891
- Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflows
- DOI 10.1007/s11664-006-0322-7
- Z Chen A Kumar M Mona 2006 J. Electron. Mater. 35 2126 1:CAS:528:DC%2BD2sXms1eluw%3D%3D 10.1007/s11664-006-0322-7 2006JEMat..35.2126C (Pubitemid 46140900)
- (2006) Journal of Electronic Materials , vol.35 , Issue.12 , pp. 2126-2134
- Chen, Z.¹ Kumar, A.² Mona, M.³

13
- 42449143603
- Piscataway, NJ: IEEE
- Y.C. Shon, J. Yu, S.K. Kang, D.Y. Shih, and T.Y. Lee, Proceedings of the 55th Electronic Components and Technology Conference (Piscataway, NJ: IEEE, 2005), pp. 83-88.
- (2005) Proceedings of the 55th Electronic Components and Technology Conference , pp. 83-88
- Shon, Y.C.¹ Yu, J.² Kang, S.K.³ Shih, D.Y.⁴ Lee, T.Y.⁵

14
- 33845562112
- Piscataway, NJ: IEEE
- Y.D. Jeon, Y.B. Lee, and Y.S. Choi, Proceedings of the 56th Electronic Components and Technology Conference (Piscataway, NJ: IEEE, 2006), pp. 119-124.
- (2006) Proceedings of the 56th Electronic Components and Technology Conference , pp. 119-124
- Jeon, Y.D.¹ Lee, Y.B.² Choi, Y.S.³

15
- 33845692077
- Interfacial reaction issues for lead-free electronic solders
- DOI 10.1007/s10854-006-9031-5
- CE Ho SC Yang CR Kao 2007 J. Mater. Sci.: Mater. Electron. 18 155 1:CAS:528:DC%2BD28XhtlWntLvN 10.1007/s10854-006-9031-5 (Pubitemid 44963683)
- (2007) Journal of Materials Science: Materials in Electronics , vol.18 , Issue.1-3 , pp. 155-174
- Ho, C.E.¹ Yang, S.C.² Kao, C.R.³

16
- 33845677127
- Interfacial reactions of Sn-Cu/Ni couples at 250 °C
- DOI 10.1557/jmr.2006.0298
- SW Chen CH Wang 2006 J. Mater. Res. 21 2270 1:CAS:528: DC%2BD28Xpsl2gsrg%3D 10.1557/jmr.2006.0298 2006JMatR..21.2270C (Pubitemid 44946047)
- (2006) Journal of Materials Research , vol.21 , Issue.9 , pp. 2270-2277
- Chen, S.-W.¹ Wang, C.-H.²

17
- 30844463021
- Joints soldered on electroless Ni-Au surfaces using Cu-containing flux: Strength, microstructure and mechanism of improvement
- DOI 10.2320/matertrans.46.2380
- S Kumamoto H Sakurai K Ikeda K Suganuma 2005 Mater. Trans. 46 2380 1:CAS:528:DC%2BD28XjsleisA%3D%3D 10.2320/matertrans.46.2380 (Pubitemid 43105587)
- (2005) Materials Transactions , vol.46 , Issue.11 , pp. 2380-2385
- Kumamoto, S.¹ Sakurai, H.² Ikeda, K.³ Suganuma, K.⁴

18
- 42449133709
- 1:CAS:528:DC%2BD1cXkvF2gurs%3D 10.1007/s11664-008-0408-5 2008JEMat.37.806K
- S Kumamoto H Sakurai Y Kukimoto K Suganuma 2008 J. Electron. Mater. 37 806 1:CAS:528:DC%2BD1cXkvF2gurs%3D 10.1007/s11664-008-0408-5 2008JEMat..37..806K
- (2008) J. Electron. Mater. , vol.37 , pp. 806
- Kumamoto, S.¹ Sakurai, H.² Kukimoto, Y.³ Suganuma, K.⁴

19
- 78049520748
- 1:CAS:528:DC%2BD1MXivVKisb4%3D 10.5104/jiepeng.1.48
- S Kumamoto H Sakurai Y Kukimoto K Suganuma 2008 Trans. Jpn. Inst. Electron. Packag. 1 48 1:CAS:528:DC%2BD1MXivVKisb4%3D 10.5104/jiepeng.1.48
- (2008) Trans. Jpn. Inst. Electron. Packag. , vol.1 , pp. 48
- Kumamoto, S.¹ Sakurai, H.² Kukimoto, Y.³ Suganuma, K.⁴

20
- 3142756580
- 1:CAS:528:DC%2BD2cXlvFals7w%3D 10.1016/j.scriptamat.2004.06.027
- M Date T Shoji M Fujiyoshi K Sato KN Tu 2004 Scr. Mater. 51 641 1:CAS:528:DC%2BD2cXlvFals7w%3D 10.1016/j.scriptamat.2004.06.027
- (2004) Scr. Mater. , vol.51 , pp. 641
- Date, M.¹ Shoji, T.² Fujiyoshi, M.³ Sato, K.⁴ Tu, K.N.⁵

21
- 6344258511
- 1:CAS:528:DC%2BD2cXotl2is74%3D 10.1557/JMR.2004.0371 2004JMatR.19.2887D
- M Date KN Tu 2004 J. Mater. Res. 19 2887 1:CAS:528:DC%2BD2cXotl2is74%3D 10.1557/JMR.2004.0371 2004JMatR..19.2887D
- (2004) J. Mater. Res. , vol.19 , pp. 2887
- Date, M.¹ Tu, K.N.²

22
- 30844470239
- Interfacial reaction and mechanical characterization of eutectic Sn-Zn/ ENIG solder joints during reflow and aging
- DOI 10.2320/matertrans.46.2386
- JW Yoon HS Chun SB Jung 2005 Mater. Trans. 46 2386 1:CAS:528: DC%2BD28XjsleisQ%3D%3D 10.2320/matertrans.46.2386 (Pubitemid 43105588)
- (2005) Materials Transactions , vol.46 , Issue.11 , pp. 2386-2393
- Yoon, J.-W.¹ Chun, H.-S.² Jung, S.-B.³

23
- 2442585461
- 1:CAS:528:DC%2BD2cXjsVGrur0%3D 10.2320/matertrans.45.734
- Y Sogo T Hojo H Iwanishi A Hirose KF Kobayashi A Yamaguchi A Furusawa K Nishida 2004 Mater. Trans. 45 734 1:CAS:528:DC%2BD2cXjsVGrur0%3D 10.2320/matertrans.45.734
- (2004) Mater. Trans. , vol.45 , pp. 734
- Sogo, Y.¹ Hojo, T.² Iwanishi, H.³ Hirose, A.⁴ Kobayashi, K.F.⁵ Yamaguchi, A.⁶ Furusawa, A.⁷ Nishida, K.⁸

24
- 4544280000
- 1:CAS:528:DC%2BD2cXntlSksLY%3D 10.1016/j.jallcom.2004.03.138
- KS Kim JM Yang CH Yu IO Jung HH Kim 2004 J. Alloy. Compd. 379 314 1:CAS:528:DC%2BD2cXntlSksLY%3D 10.1016/j.jallcom.2004.03.138
- (2004) J. Alloy. Compd. , vol.379 , pp. 314
- Kim, K.S.¹ Yang, J.M.² Yu, C.H.³ Jung, I.O.⁴ Kim, H.H.⁵

25
- 0348107251
- 1:CAS:528:DC%2BD3sXpslSmt7o%3D 10.1007/s11664-003-0019-0 2003JEMat.32.1249H
- CW Hwang KS Kim K Suganuma 2003 J. Electron. Mater. 32 1249 1:CAS:528:DC%2BD3sXpslSmt7o%3D 10.1007/s11664-003-0019-0 2003JEMat..32.1249H
- (2003) J. Electron. Mater. , vol.32 , pp. 1249
- Hwang, C.W.¹ Kim, K.S.² Suganuma, K.³

26
- 14844322363
- Shanghai: IEEE
- C.M.L. Wu and C.M.T. Law, Proceedings of the 6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (Shanghai: IEEE, 2004), pp. 47-51.
- (2004) Proceedings of the 6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis , pp. 47-51
- Wu, C.M.L.¹ Law, C.M.T.²

27
- 0036698765
- 1:CAS:528:DC%2BD38Xnt1egsr4%3D 10.2320/matertrans.43.1887
- Y Chonan T Komiyama J Onuki R Urao T Kimura T Nagano 2002 Mater. Trans. 43 1887 1:CAS:528:DC%2BD38Xnt1egsr4%3D 10.2320/matertrans.43.1887
- (2002) Mater. Trans. , vol.43 , pp. 1887
- Chonan, Y.¹ Komiyama, T.² Onuki, J.³ Urao, R.⁴ Kimura, T.⁵ Nagano, T.⁶

28
- 4344681538
- 1:CAS:528:DC%2BD3sXivFGmsbg%3D 10.2207/qjjws.21.116
- Y Nakahara K Hira R Ninomiya M Tagami M Sugai S Nakata 2003 Q. J. Jpn. Weld. Soc. 21 116 1:CAS:528:DC%2BD3sXivFGmsbg%3D 10.2207/qjjws.21.116
- (2003) Q. J. Jpn. Weld. Soc. , vol.21 , pp. 116
- Nakahara, Y.¹ Hira, K.² Ninomiya, R.³ Tagami, M.⁴ Sugai, M.⁵ Nakata, S.⁶

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.