Mechanical size effects in miniaturized lead-free solder joints

Journal of Electronic Materials

Volumn 37, Issue 1, 2008, Pages 102-109

  Zimprich, Peter ^a   Saeed, Usman ^a   Betzwar Kotas, Agnieszka ^a   Weiss, Brigitte ^a   Ipser, Herbert ^a  

^a UNIVERSITY OF VIENNA   (Austria)

Author keywords

Lead free solder joints; Mechanical constraints; Mechanical size effects; Reliability; Shear test; Stress relaxation; Tensile test

Indexed keywords

LEAD-FREE SOLDER JOINTS; MECHANICAL CONSTRAINTS; MECHANICAL SIZE EFFECTS; SHEAR TESTS; TENSILE TESTS;

CONSTRAINT THEORY; HIGH TEMPERATURE EFFECTS; MICROELECTRONICS; QUALITY CONTROL; RELIABILITY THEORY; STRESS RELAXATION;

SOLDERED JOINTS;

EID: 37249015499     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0278-2     Document Type: Article

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