SCOPUS 정보 검색 플랫폼

Volumn 38, Issue 12, 2009, Pages 2685-2693

Microstructure and orientation evolution of the Sn phase as a function of position in ball grid arrays in Sn-Ag-Cu solder joints

(3) Lee, Tae Kyu a Liu, Kuo Chuan a Bieler, Thomas R b

a CISCO SYSTEMS (United States)

b MICHIGAN STATE UNIVERSITY (United States)

Author keywords

Lead free solder; Microstructure; Orientation image microscopy (OIM); Polarized image; Sn grain orientation

Indexed keywords

DISTRIBUTION MAPS; GRAIN STRUCTURES; LEAD FREE SOLDERS; MICROSTRUCTURE EVOLUTIONS; MULTI-GRAIN; ORIENTATION IMAGE MICROSCOPIES; ORIENTATION IMAGING MICROSCOPY; PLASTIC BALL GRID ARRAYS; POLARIZED OPTICAL MICROSCOPY; SN GRAINS; SNAGCU SOLDER; SOLDER JOINTS; THERMAL CYCLE;

BALL GRID ARRAYS; CRYSTAL MICROSTRUCTURE; ELECTRONICS PACKAGING; GRAIN SIZE AND SHAPE; LEAD; OPTICAL DATA STORAGE; OPTICAL INSTRUMENTS; OPTICAL MICROSCOPY; PACKAGING; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; THERMAL AGING; THERMAL CYCLING; TIN ALLOYS;

TIN;

EID: 72549118368 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0873-5 Document Type: Article

Times cited : (44)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.