Size and volume effects on the strength of microscale lead-free solder joints

Journal of Electronic Materials

Volumn 38, Issue 10, 2009, Pages 2179-2183

  Yin, L M ^a   Zhang, X P ^a   Lu, Chunsheng ^b  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^b CURTIN UNIVERSITY   (Australia)

Author keywords

Intermetallic compounds; Lead free solder; Mechanical constraint; Strength; Volume effect

Indexed keywords

INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDER; MECHANICAL CONSTRAINT; STRENGTH; VOLUME EFFECT;

BRAZING; LEAD COMPOUNDS; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS; TENSILE STRENGTH; TIN; WELDING;

LEAD;

EID: 69049094846     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0858-4     Document Type: Article

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