SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 9, 2009, Pages 1896-1905

Fracture mechanics of solder bumps during ball shear testing: Effect of bump size

(4) Bang, Woong Ho a Kim, Choong Un a Kang, Suk Hoon b Oh, Kyu Hwan b

a University of Texas at Arlington (United States)

b Seoul National University (South Korea)

Author keywords

Ball shear testing; Bump deformation; Bump rotation; Crack growth rate; Shear fracture force; Solder bump size

Indexed keywords

BALL SHEAR TESTING; BUMP DEFORMATION; BUMP ROTATION; CRACK GROWTH RATE; SHEAR FRACTURE FORCE; SOLDER BUMP SIZE;

BRAZING; CRACKING (CHEMICAL); CRACKS; DEFORMATION; DYNAMIC LOADS; ELASTICITY; FRACTURE MECHANICS; FRACTURE TESTING; GROWTH RATE; LEAD; ROTATION; SPHERES; STRENGTH OF MATERIALS; TIN; WELDING;

FRACTURE;

EID: 68949160009 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0842-z Document Type: Article

Times cited : (14)

References (37)

1
- 39849089833
- Virginia: JEDEC
- JESD22-B117: BGA Bump Shear (Virginia: JEDEC, 2000).
- (2000) JESD22-B117: BGA Bump Shear

2
- 0034298171
- 10.1007/s11664-000-0006-7
- J.-H. Lee D.J. Park J.-T. Moon Y.-H. Lee D.-H. Shin Y.-S. Kim 2000 J. Electron. Mater. 29 1153 10.1007/s11664-000-0006-7
- (2000) J. Electron. Mater. , vol.29 , pp. 1153
- Lee, J.-H.¹ Park, D.J.² Moon, J.-T.³ Lee, Y.-H.⁴ Shin, D.-H.⁵ Kim, Y.-S.⁶

3
- 0036867861
- 10.1007/s11664-002-0018-6
- F. Zhang M. Li B. Balakrisnan W.T. Chen 2002 J. Electron. Mater. 31 1256 10.1007/s11664-002-0018-6
- (2002) J. Electron. Mater. , vol.31 , pp. 1256
- Zhang, F.¹ Li, M.² Balakrisnan, B.³ Chen, W.T.⁴

4
- 0034297520
- 10.1007/s11664-000-0022-7
- J.-H. Lee D.J. Park J.-T. Moon Y.-H. Lee D.H. Shin Y.-S. Kim 2000 J. Electron. Mater. 29 1264 10.1007/s11664-000-0022-7
- (2000) J. Electron. Mater. , vol.29 , pp. 1264
- Lee, J.-H.¹ Park, D.J.² Moon, J.-T.³ Lee, Y.-H.⁴ Shin, D.H.⁵ Kim, Y.-S.⁶

5
- 41849103832
- 10.1016/j.msea.2006.09.162
- J.-W. Yoon H.-S. Chun S.-B. Jung 2008 Mater. Sci. Eng. A 483-484 731 10.1016/j.msea.2006.09.162
- (2008) Mater. Sci. Eng. A , vol.483-484 , pp. 731
- Yoon, J.-W.¹ Chun, H.-S.² Jung, S.-B.³

6
- 10044219588
- 10.1007/s11664-004-0167-x
- K.-C. Chang K.-N. Chiang 2004 J. Electron. Mater. 33 1373 10.1007/s11664-004-0167-x
- (2004) J. Electron. Mater. , vol.33 , pp. 1373
- Chang, K.-C.¹ Chiang, K.-N.²

7
- 1842420405
- J.-W. Choi H.-S. Cha T.-S. Oh 2003 Met. Mater. Int. 9 273
- (2003) Met. Mater. Int. , vol.9 , pp. 273
- Choi, J.-W.¹ Cha, H.-S.² Oh, T.-S.³

8
- 30844433077
- C.-T. Peng C.-T. Kuo K.-N. Chiang T. Ku K. Chang 2006 Microelectron. Reliab. 46 523
- (2006) Microelectron. Reliab. , vol.46 , pp. 523
- Peng, C.-T.¹ Kuo, C.-T.² Chiang, K.-N.³ Ku, T.⁴ Chang, K.⁵

9
- 39849097280
- 10.1007/s11664-008-0393-8
- W.H. Bang M.-W. Moon C.-U. Kim S.H. Kang J.P. Jung K.H. Oh 2008 J. Electron. Mater. 37 417 10.1007/s11664-008-0393-8
- (2008) J. Electron. Mater. , vol.37 , pp. 417
- Bang, W.H.¹ Moon, M.-W.² Kim, C.-U.³ Kang, S.H.⁴ Jung, J.P.⁵ Oh, K.H.⁶

10
- 85100280031
- Orlando, FL
- X. Huang, S.-W. Lee, C.C. Yan, and S. Hui, Electronic Components and Technology Conference 2001 Proceedings (Orlando, FL, 2001), p. 1065.
- (2001) Electronic Components and Technology Conference 2001 Proceedings , pp. 1065
- Huang, X.¹ Lee, S.-W.² Yan, C.C.³ Hui, S.⁴

11
- 30944460146
- Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application
- DOI 10.1016/j.microrel.2005.06.008, PII S0026271405001393
- J.-W. Kim D.-G. Kim S.-B. Jung 2006 Microelectron. Reliab. 46 535 10.1016/j.microrel.2005.06.008 (Pubitemid 43109000)
- (2006) Microelectronics Reliability , vol.46 , Issue.2-4 , pp. 535-542
- Kim, J.-W.¹ Kim, D.-G.² Jung, S.-B.³

12
- 28144449941
- 10.1016/j.mee.2005.07.055
- J.-W. Kim S.-B. Jung 2005 Microelectron. Eng. 82 554 10.1016/j.mee.2005. 07.055
- (2005) Microelectron. Eng. , vol.82 , pp. 554
- Kim, J.-W.¹ Jung, S.-B.²

13
- 33748204585
- The solder on rubber (SOR) interconnection design and its reliability assessment based on shear strength test and finite element analysis
- DOI 10.1016/j.microrel.2006.07.084, PII S0026271406002083, Proceedings of the 17th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
- M.C. Yew C.Y. Chou C.S. Huang W.K. Yang K.N. Chiang 2006 Microelectron. Reliab. 46 1874 10.1016/j.microrel.2006.07.084 (Pubitemid 44308250)
- (2006) Microelectronics Reliability , vol.46 , Issue.9-11 , pp. 1874-1879
- Yew, M.C.¹ Chou, C.Y.² Huang, C.S.³ Yang, W.K.⁴ Chiang, K.N.⁵

14
- 68949084098
- 2 CRC London
- T.L. Anderson, Fracture Mechanics: Fundamentals and Applications, 2nd ed. (London, England: CRC Press, 1995)
- (1995)
- Anderson, T.L.¹

15
- 0003673118
- Hibbit, Karlson, & Sorensen, inc., ch. 7.9
- Hibbit, Karlson, & Sorensen, inc., ABAQUS/Standard Users Manual, Ver. 6.3, ch. 7.9 (2003).
- (2003) ABAQUS/Standard Users Manual, Ver. 6.3

16
- 0001723415
- 10.1016/0025-5416(81)90179-8
- B.P. Kashyap G.S. Murty 1981 Mater. Sci. Eng. 50 205 10.1016/0025- 5416(81)90179-8
- (1981) Mater. Sci. Eng. , vol.50 , pp. 205
- Kashyap, B.P.¹ Murty, G.S.²

17
- 0001404659
- 10.1007/BF00550469
- G.S. Murty 1973 J. Mater. Sci. 8 611 10.1007/BF00550469
- (1973) J. Mater. Sci. , vol.8 , pp. 611
- Murty, G.S.¹

18
- 0037081573
- The influence of prior strain rate on stress relaxation in solder alloys
- DOI 10.1016/S0921-5093(01)01120-0, PII S0921509301011200, Rate Processes in Plastic Deformation II: Towards a Unified Constitutive Theory of Deformation, TMS Fall Meeting 2000
- M.W. Woodmansee R.W. Neu 2002 Mater. Sci. Eng. A 322 79 10.1016/S0921-5093(01)01120-0 (Pubitemid 34135035)
- (2002) Materials Science and Engineering A , vol.322 , Issue.1-2 , pp. 79-88
- Woodmansee, M.W.¹ Neu, R.W.²

19
- 27144537802
- 10.1007/s11664-005-0252-9
- W.H. Bang K.H. Oh J.P. Jung J.W. Morris Jr. F. Hua 2005 J. Electron. Mater. 34 1287 10.1007/s11664-005-0252-9
- (2005) J. Electron. Mater. , vol.34 , pp. 1287
- Bang, W.H.¹ Oh, K.H.² Jung, J.P.³ Morris, Jr.J.W.⁴ Hua, F.⁵

20
- 0032083760
- 10.1016/S1359-6462(98)00149-3
- R.J. McCabe M.E. Fine 1998 Scr. Mater. 39 189 10.1016/S1359-6462(98) 00149-3
- (1998) Scr. Mater. , vol.39 , pp. 189
- McCabe, R.J.¹ Fine, M.E.²

21
- 0018516933
- SUPERPLASTIC BEHAVIOR OF Pb-Sn EUTECTIC ALLOY.
- DOI 10.1016/0025-5416(79)90009-0
- S.T. Lam A. Arieli A.K. Mukherjee 1979 Mater. Sci. Eng. 40 73 10.1016/0025-5416(79)90009-0 (Pubitemid 10428512)
- (1979) Materials science and engineering , vol.40 , Issue.1 , pp. 73-79
- Lam, S.T.¹ Arieli, A.² Mukherjee, A.K.³

22
- 0003630507
- McGraw Hill New York
- G.E. Dieter, Mechanical metallurgy, SI metric ed. (New York: Mcgraw Hill, 1988)
- (1988) Mechanical Metallurgy, SI Metric Ed.
- Dieter, G.E.¹

23
- 0036170345
- Semi-graphical methods for the calculation of real areas of loaded contact by means of the Abbott-firestone bearing curve
- DOI 10.1115/1.1398545
- V.S. Radchik B. Ben-Nissan W.H. Muller 2002 ASME J. Tribol. 124 223 10.1115/1.1398545 (Pubitemid 34155970)
- (2002) Journal of Tribology , vol.124 , Issue.1 , pp. 223-226
- Radchik, V.S.¹ Ben-Nissan, B.² Muller, W.H.³

24
- 0000642085
- E.J. Abbott F.A. Firestone 1933 ASME Mech. Eng. 55 569
- (1933) ASME Mech. Eng. , vol.55 , pp. 569
- Abbott, E.J.¹ Firestone, F.A.²

25
- 18644380281
- A finite element study of elasto-plastic hemispherical contact against a rigid flat
- DOI 10.1115/1.1866166
- R.L. Jackson I. Green 2005 ASME J. Tribol. 127 343 10.1115/1.1866166 (Pubitemid 40664765)
- (2005) Journal of Tribology , vol.127 , Issue.2 , pp. 343-354
- Jackson, R.L.¹ Green, I.²

26
- 34247507250
- Plastic deformation and contact area of an elastic-plastic contact of ellipsoid bodies after unloading
- DOI 10.1016/j.triboint.2007.02.015, PII S0301679X07000485
- J. Jamari D.J. Schipper 2007 Tribol. Int. 40 1311 10.1016/j.triboint. 2007.02.015 (Pubitemid 46654559)
- (2007) Tribology International , vol.40 , Issue.8 , pp. 1311-1318
- Jamari, J.¹ Schipper, D.J.²

27
- 0032653790
- 10.1007/s11661-999-0279-2
- J.J. Stephens D.R. Frear 1999 Metall. Mater. Trans. A 30 1301 10.1007/s11661-999-0279-2
- (1999) Metall. Mater. Trans. A , vol.30 , pp. 1301
- Stephens, J.J.¹ Frear, D.R.²

28
- 68949112815
- Ph.D. thesis, Cornell University-Ithaca, NY
- J.R. Wilcox (Ph.D. thesis, Cornell University-Ithaca, NY, 1990).
- (1990)
- Wilcox, J.R.¹

29
- 0000052155
- D.H. Avery W.A. Backofen 1965 Trans. ASM 58 551
- (1965) Trans. ASM , vol.58 , pp. 551
- Avery, D.H.¹ Backofen, W.A.²

30
- 51649150578
- 10.1007/BF02669524
- Z. Mei J.W. Morris Jr. M.C. Shine T.S.E. Summers 1991 J. Electron. Mater. 20 599 10.1007/BF02669524
- (1991) J. Electron. Mater. , vol.20 , pp. 599
- Mei, Z.¹ Morris Jr., J.W.² Shine, M.C.³ Summers, T.S.E.⁴

31
- 0342664319
- Nashville, TN
- E. Savage and G. Getzan, International Society for Hybrid Microelectronics 1990 Proceedings (Nashville, TN, 1990), p. 669.
- (1990) International Society for Hybrid Microelectronics 1990 Proceedings , pp. 669
- Savage, E.¹ Getzan, G.²

32
- 0029389627
- 10.1007/BF02655466
- E.W. Hare R.G. Stang 1995 J. Electron. Mater. 24 1473 10.1007/BF02655466
- (1995) J. Electron. Mater. , vol.24 , pp. 1473
- Hare, E.W.¹ Stang, R.G.²

33
- 0018467326
- DEFORMATION OF Pb-Sn EUTECTIC ALLOYS AT RELATIVELY HIGH STRAIN RATES.
- DOI 10.1016/0001-6160(79)90106-8
- D. Grivas K.L. Murty J.W. Morris Jr. 1979 Acta Metall. 27 731 10.1016/0001-6160(79)90106-8 (Pubitemid 9453178)
- (1979) Acta Metall , vol.27 , Issue.5 , pp. 731-737
- Grivas, D.¹ Murty, K.L.² Morris Jr., J.W.³

34
- 0036680574
- Influence of intermetallic compounds on the adhesive strength of solder joints
- DOI 10.1016/S0921-5093(01)01820-2, PII S0921509301018202
- H.-T. Lee M.-H. Chen 2002 Mater. Sci. Eng. A 333 24 10.1016/S0921- 5093(01)01820-2 (Pubitemid 34789095)
- (2002) Materials Science and Engineering A , vol.333 , Issue.1-2 , pp. 24-34
- Lee, H.-T.¹ Chen, M.-H.²

35
- 3242670906
- Tensile fracture of tin-lead solder joints in copper
- DOI 10.1016/j.msea.2004.02.049, PII S0921509304002242
- K.H. Prakash T. Sritharan 2004 Mater. Sci. Eng. 379 277 10.1016/j.msea.2004.02.049 (Pubitemid 38945947)
- (2004) Materials Science and Engineering A , vol.379 , Issue.1-2 , pp. 277-285
- Prakash, K.H.¹ Sritharan, T.²

36
- 68949137710
- M.S. thesis, University of California-Berkeley
- L.K. Quan (M.S. thesis, University of California-Berkeley, 1988).
- (1988)
- Quan, L.K.¹

37
- 33947538226
- Effect of interfacial reaction on the tensile strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P solder joints
- DOI 10.1007/s11664-006-0008-1
- Z. Chen M. He A. Kumar G.J. Qi 2007 J. Electron. Mater. 36 17 10.1007/s11664-006-0008-1 (Pubitemid 46472487)
- (2007) Journal of Electronic Materials , vol.36 , Issue.1 , pp. 17-25
- Chen, Z.¹ He, M.² Kumar, A.³ Qi, G.J.⁴

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.