Investigations of the test parameters and bump structures in the shear test of flip chip solder bump

Thin Solid Films

Volumn 504, Issue 1-2, 2006, Pages 405-409

  Kim, Jong Woong ^a   Kim, Dae Gon ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Finite element analysis; Flip chip; Optimization; Solder

Indexed keywords

COMPUTATION THEORY; FINITE ELEMENT METHOD; OPTIMIZATION; SHEAR STRENGTH; SOLDERED JOINTS; SOLDERING ALLOYS;

FLIP CHIP SOLDER BUMPS; FLIP CHIPS; SHEAR TEST;

FLIP CHIP DEVICES;

EID: 33644929187     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.09.058     Document Type: Conference Paper

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