Effect of joint size and pad metallization on solder mechanical properties

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 113-122

  Darveaux, Robert ^a,c   Reichman, Corey ^a   Berry, C J ^a   Hsu, Wen Sung ^c   Syed, Ahmer ^a   Kim, Chang Woo ^b   Ri, Jung Hun ^b   Kim, Tae Seong ^b  

^a AMKOR TECHNOLOGY   (United States)

^b Amkor Technology Korea Inc   (South Korea)

^c ARIZONA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC COMPONENTS; PAD METALLIZATION;

ARSENIC COMPOUNDS; AUTOMOBILE PARTS AND EQUIPMENT; BRAZING; COMPUTER NETWORKS; COPPER; CREEP; DROPS; FATIGUE TESTING; FINITE ELEMENT METHOD; FLUID MECHANICS; INTERMETALLICS; LIFE CYCLE; MECHANICAL PROPERTIES; MECHANICAL TESTING; METALLIZING; TESTING; WELDING;

CREEP RESISTANCE;

EID: 51349087365     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4549957     Document Type: Conference Paper

References (17)

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