Microelectronic-like packaging for silicon photonics: A 10 Gbps multi-chip-module optical receiver based on Ge-on-Si photodiode

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Bernabé, Stéphane ^a   Kopp, Christophe ^a   Lombard, Laurent ^a   Fedeli, Jean Marc ^a  

^a CEA GRENOBLE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

10 GBPS; AIR CAVITY; ASSEMBLY YIELDS; BUTTERFLY PACKAGES; BYPASS CAPACITORS; CMOS PHOTONICS; ELECTRICAL CONNECTION; FIBER PIGTAILS; HIGH SPEED; INTEGRATED DEVICE; MULTI-CHIP; OPEN EYE DIAGRAMS; OPTOELECTRONIC INTEGRATED CIRCUITS; OPTOELECTRONIC RECEIVER; PIN COUNTS; QUAD FLAT NO LEADS; SI PHOTODIODES; SILICON PHOTONICS; VOLUME PRODUCTION;

BANDWIDTH; ELECTRIC CONNECTORS; GERMANIUM; INTEGRATED CIRCUITS; MICROELECTRONICS; OPTICAL FIBERS; OPTOELECTRONIC DEVICES; PHOTODIODES; STANDARDIZATION;

PACKAGING;

FIBER OPTICS; GERMANIUM; PACKAGING; STANDARDS;

EID: 78651321158     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642980     Document Type: Conference Paper

References (6)

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