Application-specific optoelectronic packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 794-800

  Velsher, Ben ^a  

^a Kyocera America Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; GLASS FIBERS; HERMETIC DEVICES; INTERCONNECTION NETWORKS; OPTICAL COMMUNICATION; OPTOELECTRONIC DEVICES; PHOTODETECTORS; THERMAL EFFECTS;

OPTOELECTRONIC PACKAGING;

ELECTRONICS PACKAGING;

EID: 0036292980     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Optical assembly must catch up
2. Automation of optoelectronic assembly
3. Fiber and alignment technology for OE components
4. MEMS technology ushers in a new age in optical switching
5. Hermetic packaging: A neglected 'Holy Grail?'