Heterogeneous integration of OE arrays with Si electronics and microoptics

IEEE Transactions on Advanced Packaging

Volumn 25, Issue 1, 2002, Pages 43-49

  Liu, Yue ^a  

^a HONEYWELL TECHNOLOGY CENTER   (United States)

Author keywords

ASIC; I Os; SPA technology

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; LASER APPLICATIONS; MICROOPTICS; OPTICAL INTERCONNECTS; PHOTODETECTORS; VLSI CIRCUITS;

VERTICAL CAVITY SURFACE EMITTING LASERS (VCSEL) TECHNOLOGY;

INTEGRATED OPTOELECTRONICS;

EID: 0036479021     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2002.1017684     Document Type: Conference Paper

References (7)

1. Commercialization of Honeywell's VCSEL technology
2. High speed characteristics of VCSELs
3. VCSEL based modules for optical interconnects
4. 3D optoelectronic stacked processors
5. FAST-Net optical interconnection prototype demonstration
6. Integrated VCSELs, MSM photodetector, and GaAs MESFETs for low cost optical interconnects
7. Description and evaluation of the FAST-Net smart pixel-based optical interconnection prototype