Investigation of Cu stud bumping for single chip flip-chip assembly

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1181-1186

  Klein, M ^a   Busse, E ^a   Kaschlun, K ^a   Oppermann, H ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ASSEMBLY; CHIP SCALE PACKAGES; COMPACTION; COPPER; ENERGY DISPERSIVE SPECTROSCOPY; GROWTH (MATERIALS); HARDNESS; INFRARED SPECTROSCOPY; INTERMETALLICS; METALLIZING; SCANNING ELECTRON MICROSCOPY; SOLDERING; SOLDERING ALLOYS; THERMAL EFFECTS; TIN ALLOYS;

SINGLE CHIP BUMPING METHOD; STUD BUMPING; THERMOCOMPRESSION; THERMOSONIC BONDING;

FLIP CHIP DEVICES;

EID: 10444288778     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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