The dawn of 3Dpackaging as system-in-package (SIP)

IEICE Transactions on Electronics

Volumn E84-C, Issue 12, 2001, Pages 1763-1770

  Kada, Morihiro ^a  

^a IC Development Group   (Japan)

Author keywords

3d package; Cellular phone; CSP; SIP; Stacked csp

Indexed keywords

EID: 28044443282     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. R. Ristelhueber, "Expanding role of packaging seem relegating SoC to niche status," EE Times, Nov. 1999.
2. M. Kada, "Packaging trends for mobile applications," Halbleiter-Industrie 2000, Berlin, Sept. 2000.
3. M. Koyanagi, "Develop five element technologies for wafer level 3D packaging," Nikkei Microdevices, pp.50-51, Aug. 1999.
4. K. Takahashi, "3D chip stacked packaging technology," Internepcon Japan Seminar, 2001.