-
1
-
-
85076295147
-
-
see documents ISO 14644-1 through ISO 14644-7 Standards are published by ISO-Internati onal Organisation for Standardization
-
http://www.iest.org; see documents ISO 14644-1 through ISO 14644-7 Standards are published by ISO-Internati onal Organisation for Standardization (2004).
-
(2004)
-
-
-
2
-
-
85076263731
-
-
http://www.clean-air-solutions.comlbasic.html .
-
-
-
-
5
-
-
85076283167
-
-
related web page s
-
Electrostatic Discharge Association, see www.esda.orgl basics/part I.cfm and related web page s.
-
-
-
-
6
-
-
85076265740
-
-
JEDEC website http://www.jedec.org .
-
-
-
-
7
-
-
85076287994
-
-
The British Amateur Electronics Club web site at http://membeTS .tripod .coml, baecIDEC90/comp.htm.
-
-
-
-
9
-
-
85076279665
-
-
the NIST webs ite
-
Solder material properties at the NIST webs ite: http:// www.boulder.nist.gov/div853/lead%20free/propsOI.html .
-
-
-
-
10
-
-
0032002866
-
Getting Dressed for BGA Rework
-
P. HALLEE; Getting Dressed for BGA Rework. Surface Mount Tech. No.2 p. 72, 1998.
-
(1998)
Surface Mount Tech
, pp. 72
-
-
Hallee, P.1
-
11
-
-
0033357733
-
-
Twenty Fourth IEEElCPMT International ElecIronies Manufacturing Technology Symposium, Austin, TX
-
J. D. PHILPOTT, T. A. NGUTY, N. N. EKERE, and G. D. JONES, Effect of CSP Rework on Surface Intermetallic Growth, Twenty Fourth IEEElCPMT International ElecIronies Manufacturing Technology Symposium, Austin, TX, pp. 141-147, 1999.
-
(1999)
Effect of CSP Rework on Surface Intermetallic Growth
, pp. 141-147
-
-
Philpott, J.D.1
Nguty, T.A.2
Ekere, N.N.3
Jones, G.D.4
-
12
-
-
0037514217
-
Wire Bonding Optoelectronics Packages
-
L. R. LEVINE, Wire Bonding Optoelectronics Packages, Chip Scale Rev., Vol. 5 No.8, pp. 49-53, 2001.
-
(2001)
Chip Scale Rev
, vol.5
, Issue.8
, pp. 49-53
-
-
Levine, L.R.1
-
13
-
-
85076277340
-
-
http://www.kns.comlprodserv/tools-materials/specwire. asp.
-
-
-
-
14
-
-
0028460566
-
Plasma Modification of Polymer Surfaces for Adhesion Improvement
-
July
-
F. D. EGITTO and L. J. MATIENZO, Plasma Modification of Polymer Surfaces for Adhesion Improvement, IBM J. Res. Devel. .p. 423, July 1994.
-
(1994)
IBM J. Res. Devel
, pp. 423
-
-
Egitto, F.D.1
Matienzo, L.J.2
-
15
-
-
85076275547
-
-
http://www.dscc.dla.millDownloadslMiISpec/Docs/MIL-STD-883/std883.pdf.
-
-
-
-
16
-
-
85076270409
-
-
http://www.irvine-sensors.com/chip_stack.html.
-
-
-
-
17
-
-
85076316175
-
-
http://www.intel.com/researchlsilicon/mobilepackaging. htm.
-
-
-
-
18
-
-
0003973592
-
-
SPIE PRESS Monograph, SPIE-The International Society for Optical Engineering, Washington DC, December
-
P. RAI-CHOUDHURY, ed., MEMS and MOEMS Technology and Applications (SPIE PRESS Monograph Vol. PM85); SPIE-The International Society for Optical Engineering, Washington DC, December 2000.
-
(2000)
MEMS and MOEMS Technology and Applications
, vol.PM85
-
-
Rai-Choudhury, P.1
-
21
-
-
0342819025
-
Helical Microtubules of Graphitic Carbon
-
S. IUIMA, Helical Microtubules of Graphitic Carbon, Nature, Vol. 345, pp. 56-58, 1991.
-
(1991)
Nature
, vol.345
, pp. 56-58
-
-
Iuima, S.1
-
22
-
-
0036922695
-
Building the Nanofuture with Carbon Tubes
-
Dec. 2oo2/Jan
-
J. OUELLETTE, Building the Nanofuture with Carbon Tubes, Indust. Phys., pp. 18-21, Dec. 2oo2/Jan. 2003.
-
(2003)
Indust. Phys
, pp. 18-21
-
-
Ouellette, J.1
-
23
-
-
85076287303
-
-
http://www.zyvex.com.
-
-
-
|