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Volumn , Issue , 2006, Pages 389-436

Electronic package assembly

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[No Author keywords available]

Indexed keywords


EID: 79958292270     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1109/9780471754503.ch10     Document Type: Chapter
Times cited : (1)

References (23)
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    • P. HALLEE; Getting Dressed for BGA Rework. Surface Mount Tech. No.2 p. 72, 1998.
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    • Wire Bonding Optoelectronics Packages
    • L. R. LEVINE, Wire Bonding Optoelectronics Packages, Chip Scale Rev., Vol. 5 No.8, pp. 49-53, 2001.
    • (2001) Chip Scale Rev , vol.5 , Issue.8 , pp. 49-53
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    • Plasma Modification of Polymer Surfaces for Adhesion Improvement
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    • SPIE PRESS Monograph, SPIE-The International Society for Optical Engineering, Washington DC, December
    • P. RAI-CHOUDHURY, ed., MEMS and MOEMS Technology and Applications (SPIE PRESS Monograph Vol. PM85); SPIE-The International Society for Optical Engineering, Washington DC, December 2000.
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    • Building the Nanofuture with Carbon Tubes
    • Dec. 2oo2/Jan
    • J. OUELLETTE, Building the Nanofuture with Carbon Tubes, Indust. Phys., pp. 18-21, Dec. 2oo2/Jan. 2003.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.