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Volumn 2, Issue , 2005, Pages 1333-1338

Highly integrated VCSEL-based 10Gb/s miniature optical sub-assembly

Author keywords

[No Author keywords available]

Indexed keywords

MARKETING; OPTICAL DEVICES; SEMICONDUCTOR LASERS;

EID: 24644476186     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (19)

References (13)
  • 1
    • 0038486174 scopus 로고    scopus 로고
    • Evolution of optical subassemblies in IBM data communication transceivers
    • March/May
    • J. M. Trewhella et al., "Evolution of Optical Subassemblies in IBM data Communication Transceivers", IBM J. Res. & Dev., vol. 47, No. 2/3, March/May, (2003).
    • (2003) IBM J. Res. & Dev. , vol.47 , Issue.2-3
    • Trewhella, J.M.1
  • 2
    • 24644483773 scopus 로고    scopus 로고
    • http://www.xipmsa.org
  • 3
    • 0032069485 scopus 로고    scopus 로고
    • Microsystems and wafer processes for volume production of highly reliable fiber optic components for telecom-and datacom- application
    • H. L. Althaus, W. Gramann, K. Panzer, "Microsystems and wafer Processes for Volume Production of Highly Reliable Fiber Optic Components for Telecom-and Datacom- Application", IEEE Trans-CPMT-B, Vol. 21, No. 2, (1998)
    • (1998) IEEE Trans-CPMT-B , vol.21 , Issue.2
    • Althaus, H.L.1    Gramann, W.2    Panzer, K.3
  • 5
    • 0037259262 scopus 로고    scopus 로고
    • High-speed directly modulated fabry-Pérot and distributed-feedback spot-size-converted lasers suitable for passive alignment, unisolated operation, and uncooled environments up to 85 C
    • D. Klotzin et al., "High-Speed Directly Modulated Fabry-Pérot and Distributed-Feedback Spot-Size-Converted Lasers Suitable for Passive Alignment, Unisolated Operation, and Uncooled Environments up to 85 C", J. of Lightwave Tech., Vol 21, No. 1, (2003)
    • (2003) J. of Lightwave Tech. , vol.21 , Issue.1
    • Klotzin, D.1
  • 7
    • 0031098104 scopus 로고    scopus 로고
    • Accurate, stable, high-speed interconnections using 20- To 30-μm-diameter microsolder bumps
    • March
    • H. Tsunetusugu, T. Hayashi, K. Katsura, M. Hosoya, N. Sato, J. Kukustsu "Accurate, Stable, High-Speed Interconnections Using 20- to 30-μm-diameter Microsolder Bumps", IEEE Trans. CPMT-A, Vol. 20, No. 1, March, (1997).
    • (1997) IEEE Trans. CPMT-A , vol.20 , Issue.1
    • Tsunetusugu, H.1    Hayashi, T.2    Katsura, K.3    Hosoya, M.4    Sato, N.5    Kukustsu, J.6
  • 9
    • 50949128887 scopus 로고    scopus 로고
    • Passive alignment on optoelectronic components for electro-optical links based on single-chip technology and VCSELs
    • Strasbourg
    • J. C. Souriau, A. Cobbe, N. Delatouche, C. Massit, "Passive alignment on Optoelectronic Components for Electro-Optical Links Based on Single-Chip Technology and VCSELs", IMAPS Proc., Strasbourg, (2001)
    • (2001) IMAPS Proc.
    • Souriau, J.C.1    Cobbe, A.2    Delatouche, N.3    Massit, C.4
  • 10
    • 12344264963 scopus 로고    scopus 로고
    • PLATIMO versatile assembling facilities to bring concepts to prototypes and automated production
    • C. Kopp, L. Fulbert, K. Gilbert, "PLATIMO Versatile assembling facilities to bring concepts to prototypes and automated production", Proc. SPIE Vol.5454, (2004).
    • (2004) Proc. SPIE , vol.5454
    • Kopp, C.1    Fulbert, L.2    Gilbert, K.3
  • 11
    • 24644520027 scopus 로고    scopus 로고
    • IEEE 802.3ae Standard, August 2002
    • IEEE 802.3ae Standard, August 2002.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.