Advanced thermal enhancement and management of LED packages

International Communications in Heat and Mass Transfer

Volumn 36, Issue 3, 2009, Pages 245-248

  Weng, Chun Jen ^a  

^a LEADER UNIVERSITY   (Taiwan)

Author keywords

Heat transfer; Light emitting diode; Package; Thermal simulation model

Indexed keywords

COOLING; HEAT EXCHANGERS; HEAT RESISTANCE; HEAT TRANSFER; LIGHT EMISSION; LIGHT SOURCES; LIGHTING; PHYSICAL OPTICS; THERMOANALYSIS;

CALCULATION METHODS; CALCULATION PROCESS; COOLING CONDITIONS; EXTERNAL COOLING; HEAT TRANSFER ENHANCEMENTS; JUNCTION TEMPERATURES; LIGHT EMITTING DIODE; LUMINOUS EFFICIENCIES; PACKAGE; PACKAGE GEOMETRIES; THERMAL ENHANCEMENTS; THERMAL INTERFACES; THERMAL MANAGEMENTS; THERMAL RESISTANCES; THERMAL SIMULATION MODEL;

LIGHT EMITTING DIODES;

EID: 60449100149     PISSN: 07351933     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.icheatmasstransfer.2008.11.015     Document Type: Article

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