High-density system integration for medium power applications

2010 6th International Conference on Integrated Power Electronics Systems, CIPS 2010

Volumn , Issue , 2011, Pages

  Boroyevich, Dushan ^a   Chen, Zheng ^a   Luo, Fang ^a   Ngo, Khai ^a   Ning, Puqi ^a   Wang, Ruxi ^a   Zhang, Di ^a   Wang, Fred ^b   Burgos, Rolando ^c   Lai, Rixin ^d   Wang, Shuo ^e  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^b UNIVERSITY OF TENNESSEE   (United States)

^c ABB US Corporate Research Center   (United States)

^d GE GLOBAL RESEARCH   (United States)

^e GE AVIATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE COMPONENTS; ACTIVE FRONT ENDS; ACTIVE INTEGRATION; DATA CENTERS; DISTRIBUTED ENERGY SOURCES; ELECTRONIC POWER PROCESSING; EMI FILTERS; ENERGY STORAGE CAPACITOR; ENERGY STORAGE SYSTEMS; HIGH TEMPERATURE; HIGH-DENSITY; MOS-FET; MOTOR DRIVE; OPERATIONAL COSTS; OVERALL ENERGY EFFICIENCY; POWER APPLICATIONS; POWER DENSITIES; POWER GRIDS; POWER SYSTEMS; PWM RECTIFIER; RESEARCH EFFORTS; SIC DEVICES; SYSTEM INTEGRATION; THREE-PHASE BOOST RECTIFIERS; VEHICULAR APPLICATIONS;

AUTOMOBILE ELECTRONIC EQUIPMENT; DC-DC CONVERTERS; ELECTRIC DRIVES; ELECTRIC POWER SYSTEM PROTECTION; ENERGY EFFICIENCY; ENERGY STORAGE; FLYWHEELS; INTEGRATION; POWER ELECTRONICS; SEMICONDUCTING SILICON COMPOUNDS; SHIPS; SILICON CARBIDE; STATIC RANDOM ACCESS STORAGE;

ELECTRIC RECTIFIERS;

EID: 79953734145     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (85)

1. T. G. Wilson, Sr., "The evolution of power electronics, " IEEE Trans. Power Electron., vol. 15, pp. 439-446, 2000.
2. F. Blaabjerg, Z. Chen, and S. B. Kjaer, "Power electronics as efficient interface in dispersed power generation systems, " IEEE Trans. Power Electron., vol. 19, no. 5, pp. 1184-1194, Sep. 2004.
3. Z. Chen, J. M. Guerrero, F. Blaabjerg, "A review of the state of the art of power electronics for wind turbines, IEEE Trans. Power Electron., vol. 24, no. 8, pp. 1859-1875, Aug. 2009.
4. H. Ibrahim, A. Ilinca, J. Perron, "Energy storage systems-characteristics and comparisons, " Renewable and Sustainable Energy Reviews, Elsevier Ltd., vol. 12, no. 5, pp. 1221-1250, June 2008. (Pubitemid 351492608)
5. R. Strzelecki, G. Benysek (editors), Power electronics in smart electrical energy networks, London: Springer-Verlag Ltd., 2008.
6. A. Emadi, M. Ehsani, and J. M. Miller, Vehicular Electric Power Systems - Land, Sea, Air, and Space Vehicles, New York, NY: Marcel Dekker, Inc., 2003.
7. A. Kawahashi, "A new-generation hybrid electric vehicle and its supporting power semiconductor devices, " Proc. IEEE ISPSD, pp. 23-29, May 2004.
8. K. Yamada, H. Hanada, and S. Sasaki, "The motor control technologies for GS450h hybrid system, " Proc. EVS-22, Yokohama, Japan, pp. 827-835, Oct. 2006.
9. C. C. Chan, "The state of the art of electric, hybrid, and fuel cell vehicles, " Proc. of the IEEE, vol. 95, no. 4, pp. 704-718, Apr. 2007.
10. A. Emadi, Y. J. Lee, K. Rajashekara, "Power electronics and motor drives in electric, hybrid electric, and plug-in hybrid electric vehicles, " IEEE Trans. Industrial Electron., vol. 55, no. 6, pp. 2237-2245, Sep. 2008.
11. S. Cutts, "A Collaborative Approach to the More Electric Aircraft, " Proc. IEE PEMD'02, pp. 223-228, Apr. 2002. (Pubitemid 35004576)
12. J. A. Rosero, J. A. Ortega, E. Aldabas, and L. Romeral, "Moving towards a more electric aircraft, " IEEE Aerosp. Electron. Syst. Mag., vol. 22, no. 3, pp. 3-9, Mar. 2007. (Pubitemid 46527340)
13. MOET Technical Report (MOET-0.02-AF-DELPublicRe-port-0001-09-R1.0), Toulouse, France: MOET Consortium, Dec. 2009. Available: http://www.eurtd.com/ moet/PDF/MOET-Public-Technical-report.pdf; accessed 2010.01.15.
14. J. G. Ciezki and R. W. Ashton, "Selection and stability issues associated with a navy shipboard DC zonal electric distribution system, " IEEE Trans. on Pow. Del., vol.15, no. 2, pp. 665-669, Apr. 2000.
15. T. Ericsen, Y. Khersonsky, and P. K. Steimer, "PEBB concept applications in high power electronics converters, " Proc. IEEE PESC, pp. 2284-2289, Sep. 2005. (Pubitemid 46379495)
16. T. J. McCoy and J. V. Amy, "The state-of-the-art of integrated electric power and propulsion systems and technologies on ships, " Proc. IEEE ESTS, pp. 340-344, Apr. 2009.
17. D. Boroyevich, R. Burgos, L. Arnedo, and F. Wang, "Synthesis and integration of future electronic power distribution systems, " Proc. IEEE PCC, Nagoya, Japan, 2007.
18. J. W. Kolar, U. Drofenik, J. Biela, M. L. Heldwein, H. Ertl, T. Friedli, and S. D. Round, "PWM converter power density barriers, " Proc. IEEE PCC, Nagoya, Japan, 2007.
19. M. Gerber and J. A. Ferreira, "A system integration philosophy for demanding requirements in power electronics, " Proc. IEEE IAS, pp. 1389-1396, Sep. 2007.
20. J. A. Ferreira (Guest Editor), "Special Issue on Integrated Power Electronics, " IEEE Trans. Power Electron., vol. 20, no. 3, pp. 521-720, May 2005.
21. J. Biela, U. Badstuebner, and J. W. Kolar, " Impact of power density maximization on efficiency of dc-dc converter systems, " IEEE Trans. Power Electron., vol. 24, no. 1, pp. 288-300, Jan. 2009.
22. M. Pavlovsky, S. de Haan, and J. A. Ferreira, "Reaching high power density in multikilowatt dc-dc converters with galvanic isolation, " IEEE Trans. Power Electron., vol. 24, no. 3, pp. 603-612, Mar. 2009.
23. J. Biela, A. Wirthmueller, R. Waespe, M. L. Heldwein, K. Raggl, and J. W. Kolar, "Passive and active hybrid integrated EMI filters, " IEEE Trans. Power Electron., vol. 24, no. 5, pp. 1340-1349, May 2009.
24. M. L. Heldwein and J. W. Kolar, "Impact of EMC filters on the power density of modern three-phase PWM converters, " IEEE Trans. Power Electron., vol. 24, no. 6, pp. 1577-1588, June 2009.
25. J. Biela, U. Badstuebner, and J. W. Kolar, "Design of a 5-kW, 1-U, 10-kW/dm3 resonant dc-dc converter for telecom applications, " IEEE Trans. Power Electron., vol. 24, no. 7, pp. 1701-1710, July 2009.
26. K. Raggl, T. Nussbaumer, G. Doerig, J. Biela, and J. W. Kolar, "Comprehensive design and optimization of a high-power-density single-phase boost PFC, " IEEE Trans. Ind. Electron., vol. 56, no. 7, pp. 2574-2587, July 2009.
27. Y. Wang; S. W. H. de Haan, and J. A. Ferreira, "Potential of improving PWM converter power density with advanced components, " Proc. EPE, Sep. 2009.
28. T. Friedli, S. D. Round, D. Hassler, and J. W. Kolar, "Design and performance of a 200-kHz all-SiC JFET current dc-link back-to-back converter, " IEEE Trans. Ind. Appl., vol. 45, no. 5, pp. 1868-1878, Sep.-Oct. 2009.
29. J. D. van Wyk, F. C. Lee, D. Boroyevich, Z. Liang, and K. Yao, "A future approach to integration in power electronics systems, " Proc. IEEE IECON, vol. 1, pp. 2-6, Nov. 2003.
30. D. Boroyevich, J. D. van Wyk, F. C. Lee, and Z. Liang, "A view at the future of integration in power electronics systems, " Proc. PCIM Europe, pp. 11-20, Jun. 2005.
31. D. Boroyevich, F. C. Lee, J. D. van Wyk, G. Q. Lu, E. P. Scott, M. Xu, R. Burgos, F. Wang, T. M. Jahns, T. A. Lipo, R. D. Lorenz, and T. P. Chow, IPEM-Based Power Electronics System Integration, Proc. CIPS, pp. 303-312, 2006.
32. A. Elasser, T. P. Chow, "Silicon carbide benefits and advantages for power electronics circuits and systems, " Proc. of the IEEE, vol. 90, no. 6, pp. 969-986, June 2002. (Pubitemid 43785870)
33. J. C. Zolper, "Emerging silicon carbide power electronics components, " Proc. IEEE APEC, vol. 1, pp. 11-17, Mar. 2005. (Pubitemid 43860758)
34. R. Rupp, C. Miesner, I. Zverev, "Combination of new generation CoolMOS and thinQ! silicon carbide Schottky diodes: new horizons in hard switching applications, " Proc. PCIM, 2001.
35. nd generation 600 V SiC Schottky diodes use merged PN/Schottky structure for surge overload protection, " Proc. IEEE APEC, pp. 170-173, Mar. 2006. (Pubitemid 44523398)
36. P. Friedrichs, R. Rupp, "Silicon carbide power devices - current developments and potential applications, " Proc. EPE, 2005.
37. P. Friedrichs, "Silicon carbide power devices - status and upcoming challenges, " Proc. EPE, Sep. 2007.
38. S. H. Ryu, S. Krishnaswami, B. Hull, J. Richmond, A. Agarwal, and A. R. Hefner, "10 kV, 5 A 4H-SiC power DMOSFET, " Proc. IEEE ISPSD, 2006.
39. P. Friedrichs, H. Mitlehner, R. Schorner, K.-O. Dohnke, and R. Elpelt, "The vertical silicon carbide JFET - a fast and low loss solid state power switching device, " Proc. EPE, 2001.
40. B. Hull, M. Das, F. Husna, R. Callanan, A. Agarwal, J. Palmour, "20 A, 1200 V 4H-SiC DMOSFETs for energy conversion systems, " Proc. IEEE ECCE, Sep. 2009.
41. T. Funaki, A. S. Kashyap, H. A. Mantooth, J. C. Balda, F. D. Barlow, T. Kimoto, and T. Hikihara, "Characterization of SiC JFET for temperature dependent device modeling, " Proc. IEEE PESC, pp. 1-6, Jun. 2006.
42. T. Funaki, T. Kimoto, and T. Hikihara, "Evaluation of capacitance-voltage characteristics for high voltage SiC-JFET, " IEICE Electron. Express, vol. 4, no. 16, pp. 517-523, 2007.
43. J. Wang, T. Zhao, J. Li, A. Q. Huang, R. Callanan, F. Husna, and A. Agarwal, "Characterization, modeling and application of 10-kV SiC MOSFET, " IEEE Trans. Electron Devices, vol. 55, no. 8, pp. 1798-1805, Aug. 2008.
44. A. S. Kashyap, P. L. Ramavarapu, S. Maganlal, T. R. McNutt, A. B. Lostetter, and H. A. Mantooth, "Modeling vertical channel junction field effect devices in silicon carbide, " Proc. IEEE PESC, pp. 3009-3014, 2004.
45. T. R. McNutt, A. R. Hefner, Jr., H. A. Mantooth, D. Berning, S. H. Ryu, "Silicon carbide power MOSFET model and parameter extraction sequence, " IEEE Trans. Power Electronics, vol. 22, no. 2, pp. 353-362, Mar. 2007.
46. Z. Chen, P. Ning, D. Boroyevich, F. Wang, D. Jiang, R. Burgos, and K. Ngo, "Modeling and simulation of a high-temperature SiC JFET/JBS power electronics building block, " Proc. GCMS at Int. Sim. Multi-Conf., pp. 308-314, June 2009.
47. R. Burgos, Z. Chen, D. Boroyevich, and F. Wang, "Design considerations of a fast 0-Ω gate-drive circuit for 1.2 kV SiC JFET devices in phase-leg configuration, " Proc. IEEE ECCE, pp. 2293-2300, Sep. 2009.
48. Z. Chen, D. Boroyevich, R. Burgos, and F. Wang, "Characterization and modeling of 1.2 kV, 20 A SiC MOSFETs, " Proc. IEEE ECCE, pp. 1480-1487, Sep. 2009.
49. E. Cilio, J. Hornberger, B. McPherson, R. Schupbach, A. Lostetter, and J. Garrett, "A novel high density 100 kW three-phase silicon carbide (SiC) multichip power module (MCPM) inverter, " Proc. IEEE APEC, pp. 666-672, 2007.
50. L. Coppola, D. Huff, F. Wang, R. Burgos, D. Boroyevich, "Survey on high-temperature packaging materials for SiC-based power electronics modules, " Proc. IEEE PESC, pp. 2234-2240, June 2007.
51. Z. J. Shen, B. Grummel, R. McClure, A. Gordon, and A. Hefner, "High temperature, high power module design for wide bandgap semiconductors: Packaging architecture and materials considerations, " Proc. IMAPS HiTEC, pp. 170-176, May 2008.
52. S. Waffler, S. D. Round, and J. W. Kolar, " High temperature (≫200°C) isolated gate drive topologies for silicon carbide (SiC) JFET, " Proc. IEEE IECON, pp. 2867-2872, Nov. 2008.
53. P. Solomala, A. Castellazzi, M. Mermet-Guyennet and M. Johnson, "New technology and tool for enhanced packaging of semiconductor power devices, " Proc. ISIE, pp. 2020-2025, 2009.
54. P. Ning, R. Lai, D. Huff, F. Wang, and K. D. T. Ngo, "250°C SiC Power Module Package Design, " Proc. SAE Power Sys. International, paper no. 2008-01-2892, Bellevue, WA, Nov. 2008.
55. P. Ning, R. Lai, D. Huff, F. Wang and K. D. T. Ngo, "SiC wirebond multi-chip phase-leg module packaging design and testing for harsh environments, " Proc. IEEE APEC, pp. 631-636, Feb. 2009.
56. P. Ning, G. Lei, G-Q Lu, F. Wang, K. D. T. Ngo, "A novel high-temperature planar package for SiC multi-chip phase-leg power module, " Proc. IEEE APEC, pp. 2061-2067, Feb. 2009.
57. G. Bai, J. Yin, Z. Zhang, G. Q. Lu, J. D. van Wyk, "High-temperature operation of SiC power devices by low-temperature sintered silver die-attachment, " IEEE Trans. Adv. Packaging, vol. 30, issue 3, pp. 506-510, Aug. 2007. (Pubitemid 47308009)
58. R. Chen; J. D. van Wyk, S. Wang, and W. G. Odendaal, "Improving the characteristics of integrated EMI filters by embedded conductive layers, " IEEE Trans. Power Electron., vol. 20, no. 3, pp. 611-619, May 2005. (Pubitemid 40715009)
59. S. J. Marais, J. A. Ferreira, and J. D. van Wyk, "Integrated filters for switch-mode power supplies, " Proc. IEEE IAS, pp. 809-816, Oct. 1995.
60. S. Ogasawara, H. Ayano, and H. Akagi, "An active circuit for cancellation of common-mode voltage generated by a PWM inverter, " IEEE Trans. Power Electron., vol. 13, no. 5, pp. 835-841, Sep. 1998. (Pubitemid 128747806)
61. A. C. Baisden, D. Boroyevich, and J. D. van Wyk, "High frequency modeling of a converter with an RF-EMI filter, " Proc. IEEE IAS, vol. 5, pp. 2290-2295, Oct. 2006. (Pubitemid 47514924)
62. Y. Maillet, R. Lai, S. Wang, F. Wang, R. Burgos, and D. Boroyevich, "High-density EMI filter design for dc-fed motor drives, " Proc. IEEE APEC, pp. 1998-2005, Feb. 2009.
63. F. Luo, M. H. F. Lim, R. Robutel, S. Wang, F. Wang, and D. Boroyevich, "Research on LTCC capacitors and its potential for high power converters, " Proc. IEEE APEC, pp. 2034-2038, Feb. 2009.
64. S. Wang, Y. Maillet, F. Wang, D. Borojevic, and R. Burgos, "Investigation of hybrid EMI filters for common mode EMI suppression in a motor drive system, " IEEE Trans. on Power Electron., vol. PP, forthcoming, 2009.
65. T. Shimizu, Y. Jin, and G. Kimura, "DC ripple current reduction on a single-phase PWM voltage-source rectifier, " IEEE Trans. Ind. Appl., vol. 36, no. 5, pp. 1419-1428, Sep. 2000.
66. T. Shimizu, T. Fujita, G. Kimura, and J. Hirose, "A Unity Power Factor PWM Rectifier with DC Ripple Compensation, " IEEE Trans. Industrial Electron., vol. 44, no. 4, pp. 447-455, Aug. 1997. (Pubitemid 127828672)
67. R. Wang, F. Wang, R. Lai, P. Ning, R. Burgos, and D. Boroyevich, "Study of energy storage capacitor reduction for single phase PWM rectifier, " Proc. IEEE APEC, pp. 1177-1183, Feb. 2009.
68. B. Ray, H. Kosai, J. D. Scofield and B. Jordan, "200 °C operation of a dc-dc converter with SiC power devices, " Proc. IEEE APEC, pp. 998-1002, Mar. 2007.
69. D. Aggeler, J. Biela and J. W. Kolar, "A compact, high voltage 25 kW, 50 kHz dc-dc converter based on SiC JFETs, " Proc. IEEE APEC, pp. 801-807, Feb. 2008.
70. S. K. Mazumder, K. Acharya and C. M. Tan, "Design of an all-SiC radio-frequency controlled parallel dc-dc converter unit, " Proc. IEEE PESC, pp. 2833-2839, June 2007.
71. S. Mounce, B. McPherson, R. Schupbach and A. B. Lostetter, "Ultra-lightweight, high efficiency SiC based power electronic converters, " IEEE Aerospace Conference, pp. 1-19, Mar. 2006.
72. C. Cass, R. Burgos, F. Wang, and D. Boroyevich, "Three-phase ac buck rectifier using normally-on SiC JFETs at 150 kHz switching frequency, " Proc. IEEE PESC, pp. 2162-2167, Jun. 2007.
73. C. Rebbereh, H. Schierling and M. Braun, "First inverter using silicon carbide power switches only, " Proc. EPE, 2003.
74. H. R. Chang, E. Hanna and A. V. Radun, "Demonstration of silicon carbide (SiC)-based motor drive, " Proc. IEEE IECON, pp. 1116-1121, Nov. 2003.
75. J. M. Hornberger, E. Cilio, B. McPherson, R. M. Schupbach and A. B. Lostetter, "A fully integrated 300 °C, 4 kW, 3-phase, SiC motor drive module, " Proc. IEEE PESC, pp. 1048-1053, Jun. 2007.
76. R. Lai, F. Wang, P. Ning, D. Zhang, D. Jiang, R. Burgos, D. Boroyevich, K. J. Karimi, and V. D. Immanuel, "Development of a 10 kW high power density three-phase ac-dc-ac converter using SiC devices, " Proc. EPE, Sep. 2009.
77. R. Lai, F. Wang, R. Burgos, Y. Pei, D. Boroyevich, B. Wang, T. A. Lipo, V. D. Immanuel, K. J. Karimi, "A systematic topology evaluation methodology for high-density three-phase PWM ac-ac converters, " IEEE Trans. Power Electron., vol. 23, no. 6, pp. 2665-2680, Nov. 2008.
78. G. Gong, M. L. Heldwein, U. Drofenik, J. Miniboeck, K. Mino, and J. W. Kolar, "Comparative evaluation of three-phase high-power-factor AC-DC converter concepts for application in future more electric aircraft, " IEEE Trans. Ind. Electron., vol. 52, no. 3, pp. 727-737, Jun. 2005. (Pubitemid 40871109)
79. L. Asiminoaei, E. Aeloiza, J. H. Kim and P. Enjeti, "An interleaved active power filter with reduced size of passive components, " Proc. IEEE APEC, pp. 969-976, 2006. (Pubitemid 44523520)
80. S. K. T. Miller, T. Beechner, and J. Sun, "A comprehensive study of harmonic cancellation effects in interleaved three-phase VSCs, " Proc. IEEE PESC, pp. 29-35, 2007.
81. S. Schroder, P. Tenca, T. Geyer, P. Soldi, L. Garces, R. Zhang, T. Toma and P. Bordignon, "Modular high-power shunt-interleaved drive system: A realization up to 35 MW for oil & gas applications, " Proc. IEEE IAS, 2008.
82. D. Zhang, F. Wang, R. Burgos, R. Lai, T. Thacker and D. Boroyevich, "Interleaving impact on harmonic current in dc and ac passive components of paralleled three-phase voltage-source converters, " Proc. IEEE APEC, pp. 219-225, Feb. 2008.
83. D. Zhang, F. Wang, R. Burgos, R. Lai, and D. Boroyevich, "Interleaving impact on ac passive components of paralleled three-phase voltage-source converters, " Proc. IEEE IAS, Oct. 2008.
84. D. Zhang, F. Wang, R. Burgos, J. Kern, S. El-Barbari, and D. Boroyevich, "Internal fault detection and isolation for paralleled voltage source converters, " Proc. IEEE APEC, pp. 833-839, Feb. 2009.
85. D. Zhang; F. Wang, R. Burgos, and D. Boroyevich, "Common mode circulating current control of interleaved three-phase two-level voltage-source converters with discontinuous space-vector modulation, " Proc. IEEE ECCE, pp. 2801-2807, Sep. 2009.