Effects of number of reflows on the mechanical and electrical properties of BGA package

Intermetallics

Volumn 14, Issue 10-11, 2006, Pages 1375-1378

  Noh, B I ^a   Koo, J M ^a   Kim, J W ^a   Kim, D G ^a   Nam, J D ^a   Joo, J ^a   Jung, S B ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

A. Intermetallics, miscellaneous; B. Diffusion; B. Electrical resistance and other electrical properties; C. Joining

Indexed keywords

DUCTILITY; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; FUNCTION EVALUATION; SOLDERED JOINTS; TIN COMPOUNDS;

A. INTERMETALLICS, MISCELLANEOUS; B. DIFFUSION; B. ELECTRICAL RESISTANCE AND OTHER ELECTRICAL PROPERTIES; C. JOINING;

INTERMETALLICS;

EID: 33746605248     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2005.11.036     Document Type: Article

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