Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface

Materials Letters

Volumn 63, Issue 30, 2009, Pages 2687-2690

  Tsukamoto, Hideaki ^a   Nishimura, Tetsuro ^b   Nogita, Kazuhiro ^a  

^a UNIVERSITY OF QUEENSLAND   (Australia)

^b Nihon Superior Co Ltd   (Japan)

Author keywords

Crystal growth; Intermetallic compound (IMC); Lead free solder; X ray diffraction (XRD)

Indexed keywords

CU SUBSTRATE; ELECTRICAL CHARACTERISTIC; HEXAGONAL STRUCTURES; INTERMETALLIC COMPOUND (IMC); INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS; LEAD-FREE; LEAD-FREE SOLDER; PLATE INTERFACES; POLYCRYSTALLINE; SN-CU SOLDERS; SNAGCU SOLDER; X-RAY DIFFRACTION (XRD);

CRYSTAL GROWTH; CRYSTALLIZATION; DIFFRACTION; EPITAXIAL GROWTH; GRAIN BOUNDARIES; LEAD; LEAD COMPOUNDS; NICKEL; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

TIN;

EID: 70350002108     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2009.09.041     Document Type: Article

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