Thin film encapsulation for flexible AM-OLED: A review

Semiconductor Science and Technology

Volumn 26, Issue 3, 2011, Pages

  Park, Jin Seong ^a   Chae, Heeyeop ^b   Chung, Ho Kyoon ^b   Lee, Sang In ^c  

^a Dankook University   (South Korea)

^b Sungkyunkwan University   (South Korea)

^c Synos Technology Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AM-OLED; BARRIER FILMS; BARRIER PERFORMANCE; BARRIER TECHNOLOGIES; DEVICE LAYERS; DEVICE STRUCTURES; DISPLAY TECHNOLOGIES; FLEXIBLE ORGANIC LIGHT - EMITTING DIODES; GAS DIFFUSION; MOLECULAR LAYER DEPOSITION; OXYGEN PERMEATION; PERMEATION RATE; POLYMER SUBSTRATE; THIN FILM ENCAPSULATION; THIN-FILM DEPOSITIONS;

ATOMIC LAYER DEPOSITION; FLEXIBLE DISPLAYS; LIGHT EMITTING DIODES; ORGANIC LIGHT EMITTING DIODES (OLED); OXYGEN; TECHNOLOGY;

GAS PERMEABLE MEMBRANES;

EID: 79951920897     PISSN: 02681242     EISSN: 13616641     Source Type: Journal    
DOI: 10.1088/0268-1242/26/3/034001     Document Type: Article

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