Measurement of deformation and strain in flip chip on BGA (FC-BGA)

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 120-127

  Kehoe, L ^a   Guenebaut V ^a   Kelly, P V ^a  

^a 2200 Cork Airport Business Park   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

CAMERAS; CHARGE COUPLED DEVICES; ELECTRONICS PACKAGING; IMAGE ANALYSIS; INTERFEROMETRY; PLASTIC DEFORMATION; STRAIN; THERMAL CYCLING; THERMOMECHANICAL TREATMENT; WIRELESS TELECOMMUNICATION SYSTEMS;

DIGITAL IMAGE CORRELATION (DIC); SPECTROSCOPIC IMAGING; STRAIN CONCENTRATIONS;

FLIP CHIP DEVICES;

EID: 10444222551     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Pitter M.C., See C.W., Somekh M.G., Subpixel microscopic deformation analysis using correlation and artificial neural networks, Optics Express, Vol 8, No. 6, pp 322-327, 2001
2. Pendse R.D., Zhou P, Methodology for Predicting Solder Joint Reliability in Semiconductor Packages, Microelectronics Reliability 42, pp 301-305, 2002
3. B. Han, "Recent Advances of moiré and microscopic moiré interferometry for thermal deformation analyses of microelectronic devices", Experimental Mechanics, Vol. 38, pp 278-288, 1988
4. Han B,Guo Y, Lim CK, Caletka D., Verification of numerical models used in microelectronic packaging design by interferometric displacement measurement methods, ASME J Electronic Packaging, 118, pp 157-163, 1996