Digital image correlation for solder joint fatigue reliability in microelectronics packages

Microelectronics Reliability

Volumn 48, Issue 2, 2008, Pages 310-318

  Sun, Yaofeng ^a   Pang, John H L ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE TESTING; FINITE ELEMENT METHOD; MICROELECTRONICS; OPTICAL CORRELATION; THERMAL CYCLING;

DIGITAL IMAGE CORRELATION; FATIGUE RELIABILITY; MICROELECTRONICS PACKAGES; PLASTIC BALL GRID ARRAY (PBGA);

SOLDERED JOINTS;

EID: 44249115047     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.03.007     Document Type: Article

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