In-situ micro-digital image speckle correlation technique for characterization of materials' properties and verification of numerical models

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 4, 2004, Pages 659-667

  Shi, Xunqing ^a   Pang, H L J ^b   Zhang, X R ^b   Liu, Q J ^b   Ying, M ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Digital image speckle correlation; Electronic packages; Materials characterization; Numerical model verification; Reliability design methodology

Indexed keywords

ALGORITHMS; COMPUTER INTEGRATED MANUFACTURING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; FRACTURE; IMAGING TECHNIQUES; INTERFEROMETRY; INTERPOLATION; MATHEMATICAL MODELS; RELIABILITY; THERMODYNAMIC PROPERTIES;

ACCELERATED TEMPERATURE CYCLING; DIGITAL IMAGE SPECKLE CORRELATION; MATERIALS CHARACTERIZATION; MOIRE INTERFEROMETRY; NUMERICAL MODEL VERIFICATION; RELIABILITY DESIGN METHODOLOGY; THERMOMECHANICAL ANALYZER;

CHIP SCALE PACKAGES;

EID: 10244232786     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.838907     Document Type: Article

References (29)

1. J. H. Lau and Y. H. Pao, Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies. New York: McGraw-Hill, 1997.
2. E. Madenci, S. Shkarayev, and R. Mahajan, "Potential failure sites in a flip chip package with and without underfill," ASME J. Electron. Packag., vol. 120, pp. 336-341, 1998.
3. J. H. Lau and S. W. R. Lee, "Temperature-dependent popcorning analysis of plastic ball grid array package during solder reflow with fracture mechanics method," ASME J. Electron. Packag., vol. 122, pp. 34-41, 2000.
4. D. J. Xie, Y. C. Chan, J. K. L. Lai, and I. K. Hui, "Fatigue life estimation of surface mount solder joints," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 19, pp. 669-678, Sept. 1996.
5. P. Sharma, R. Natarajan, and A. Dasgupta, "Reducing accelerated test time: Use of vibration loading to accelerate ageing damage," ASME Adv. Electron. Packag., vol. 26, no. 2, pp. 1801-1805, 1999.
6. H. L. J. Pang, K. H. Ang, X. Q. Shi, and Z. P. Wang, "Mechanical deflection system (MDS) test and methodology for PBGA solder joint reliability," IEEE Trans. Adv. Packag., vol. 24, pp. 507-514, Nov. 2001.
7. X. Q. Shi, Z. P. Wang, H. L. J. Pang, X. R. Zhang, and J. R. Nie, "Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly - Part I: Creep constitutive relation and fatigue model," Acta Mech. Sinca, vol. 18, no. 3, pp. 274-287, 2002.
8. X. Q. Shi, H. L. J. Pang, Q. J. Yang, Z. P. Wang, and J. X. Nie, " Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly - Part II: Reliability experiment and numerical simulation," Acta Mech. Sinca, vol. 18, no. 4, pp. 356-367, 2002.
9. H. L. J. Pang, K. H. Ang, X. Q. Shi, and Z. P. Wang, "Mechanical deflection system (MDS) test and methodology for PBGA solder joint reliability," IEEE Trans. Adv. Packag., vol. 24, pp. 507-514, Nov. 2001.
10. S. Wei, S. Wu, I. Kao, and F. P. Chiang, "Measurement of wafer surface using shadow moiré technique with talbot effect," ASME J. Electron. Packag., vol. 120, pp. 166-170, 1998.
11. H. Ding, R. E. Powell, C. R. Hanna, and I. C. Ume, "Warpage measurement comparison using shadow moiré and projection moiré methods," IEEE Trans. Comp. Packag. Technol., vol. 25, pp. 714-721, Dec. 2002.
12. B. Hun, Y. Guo, C. K. Lim, and D. Caletka, "Verification of numerical models used in microelectronics packaging design by interferometric displacement measurement methods," ASME J. Electron. Packag., vol. 118, pp. 157-163, 1996.
13. X. Q. Shi, B. C. Liu, and F. L. Dai, "Study of failure modes of microelectronic packaging modules by holography quasi projection moiré method," Acta Mech. Sinca, vol. 13, pp. 179-185, 1997.
14. H. Y. Yeh and K. Cote, "Validation of electronic package reliability using speckle interferometry," ASME J. Electron. Packag., vol. 124, pp. 277-280, 2002.
15. W. Jang, B. W. Lee, D. W. Kim, J. W. Nah, K. W. Paik, and D. Kwon, "Evaluation of thermal shear strains in flip-chip package by electronic speckle pattern interferometry (ESPI)," in Proc. Int. Symp. Electron. Mater. Packag., Nov. 19-22, 2001, pp. 310-314.
16. Y. C. Chan, K. C. Hung, and X. Dai, "Nondestructive defect detection in multilayer ceramic capacitors using an improved digital speckle correlation method with wavelet packet noise reduction processing," IEEE Trans. Adv. Packag., vol. 23, pp. 80-87, Feb. 2000.
17. J. B. Rui, G. C. Jin, and B. Y. Xu, "A new digital speckle correlation method and its application," Acta Mech. Sinica, vol. 26, pp. 599-607, 1994.
18. D. Vogel, "MicroDAC deformation analysis on solder interconnects for flip chip," ASME Adv. Electron. Packag., vol. 26, pp. 1309-1316, 1999.
19. D. Ambrosini, D. Paoletti, and G. S. Spagnolo, "White light digital speckle photography in free convection," Optics Commun., vol. 201, pp. 39-44, 2002.
20. X. Q. Shi, W. Zhou, H. L. J. Pang, and Z. P. Wang, "Effect of temperature and strain rate on mechanical properties of 63 Sn/37 Pb solder," ASME J. Electron. Packag., vol. 121, no. 3, pp. 179-185, 1999.
21. B. Han and Y. Guo, "Determination of an effective coefficient of thermal expansion of electronic packaging components: A whole-field approach," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 19, pp. 240-247, June 1996.
22. M. C. Pfeil, V. H. Kenner, and C. H. Popelar, "Fracture toughness of filled epoxy molding compounds," Applicat. Fracture Mech. Electron. Packag. Mater., vol. 11, pp. 263-270, 1995.
23. X. Q. Shi, Z. P. Wang, and J. P. Pickering, "A new methodology for the characterization of fracture toughness of filled epoxy films involved in microelectronics packages," Microelectron. Rel., vol. 43, no. 7, pp. 1105-1115, 2003.
24. X. Q. Shi, Z. P. Wang, H. L. J. Pang, and X. R. Zhang, " Investigation of effect of temperature and strain rate on mechanical properties of underfill material by use of microtensile specimens," Polymer Testing, vol. 21, no. 6, pp. 725-733, 2002.
25. R. Darveaux, "Effect of simulation methodology on solder joint crack growth correlation," in Proc. 50th Electronic Components Technology Conf., Las Vegas, NV, 2000, pp. 1048-1058.
26. F. Feustel and E. Meusel, "Modeling of the deformation behavior of a flip chip underfill for finite element analyzes," in Proc. Micro Materials Conf., Berlin, Germany, Apr. 17-19, 2000, pp. 302-305.
27. X. Q. Shi, Z. P. Wang, W. Zhou, H. L. J. Pang, and Q. J. Yang, "A new creep constitutive model for eutectic solder alloy," ASME J. Electron. Packag., vol. 124, no. 2, pp. 85-90, 2002.
28. X. Q. Shi, H. L. J. Pang, and X. R. Zhang, "Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moire interferometry system," Microelectron. Rel., vol. 44, no. 5, pp. 841-852, 2004.
29. X. Q. Shi, H. L. J. Pang, W. Zhou, and Z. P. Wang, "Low cycle fatigue analysis of temperature and frequency effect in eutectic solder alloy," Int. J. Fatigue, vol. 22, pp. 217-228, 2000.