Micro-scale deformation measurement using the digital image correlation technique and scanning electron microscope imaging

Journal of Strain Analysis for Engineering Design

Volumn 43, Issue 8, 2008, Pages 719-728

  Jin, H ^a   Lu, W Y ^a   Korellis, J ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Digital image correlation; Ductile fracture; LIGA microsystems; Plastic zone; Scanning electron microscopy

Indexed keywords

ABS RESINS; CONCENTRATION (PROCESS); COPPER; CRACK TIPS; DEFORMATION; DIGITAL ARITHMETIC; DIGITAL IMAGE STORAGE; ELECTRON MICROSCOPES; FRACTURE TESTING; IMAGE ENHANCEMENT; LITHOGRAPHY; MECHANICAL PROPERTIES; MICROSCOPIC EXAMINATION; MICROSTRUCTURAL EVOLUTION; NICKEL ALLOYS; OPTOELECTRONIC DEVICES; SCANNING; SCANNING ELECTRON MICROSCOPY; SECONDARY EMISSION; STRAIN MEASUREMENT; SURFACES;

AREA OF INTERESTS; COPPER MESHES; DEFORMATION MEASUREMENTS; DIGITAL IMAGE CORRELATION; DIGITAL IMAGE CORRELATION TECHNIQUES; DIGITAL IMAGE CORRELATIONS; ELECTRODEPOSITED NICKELS; GOLD FILMS; IN-SITU; LIGA MICROSYSTEMS; MICROSTRUCTURAL FEATURES; PLASTIC ZONE; SCANNING ELECTRON MICROSCOPES; SCANNING ELECTRON MICROSCOPY IMAGES; SEM IMAGES; SPECIMEN SURFACES; STRAIN CONCENTRATIONS; STRAIN FIELDS; SURFACE PREPARATIONS; TENSILE SPECIMENS; THIN LAYERS;

DUCTILE FRACTURE;

EID: 55349095022     PISSN: 03093247     EISSN: None     Source Type: Journal    
DOI: 10.1243/03093247JSA412     Document Type: Article

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