Mechanical shock behavior of bulk pure Sn solder

Journal of Electronic Materials

Volumn 38, Issue 12, 2009, Pages 2746-2755

  Yazzie, K E ^a   Fei, H ^b   Williams, J J ^a   Jiang, H ^b   Chawla, N ^a,b  

^a ARIZONA STATE UNIVERSITY   (United States)

^b AZ 85281   (United States)

Author keywords

High speed video; Mechanical shock; Necking; Pb free solder

Indexed keywords

AMERICAN SOCIETY FOR TESTING AND MATERIALS; DYNAMIC BEHAVIORS; ELECTRONIC PACKAGE; ENVIRONMENTALLY BENIGN; EXPERIMENTAL OBSERVATION; FEM MODELING; GAGE LENGTH; HIGH-SPEED VIDEO; INTERMEDIATE STRAIN RATE; MECHANICAL SHOCK; MICRO-STRUCTURAL CHARACTERIZATION; MODELING AND ANALYSIS; NECKING PHENOMENON; PB FREE SOLDERS; PB-FREE ALLOYS; PURE SN; RELIABILITY MODEL; SOLDER JOINTS; SPECIMEN GEOMETRY; STRAIN DISTRIBUTIONS; STRESS-STRAIN DATA; ULTIMATE TENSILE STRENGTH; UNIFORM STRESS;

COMPUTATIONAL GEOMETRY; FINITE ELEMENT METHOD; GAGES; HIGH SPEED CAMERAS; LEAD; MATERIALS TESTING; SOLDERING ALLOYS; TENSILE STRENGTH; TIN;

STRAIN RATE;

EID: 72549096064     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0889-x     Document Type: Article

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