Evolutions of the interface and shear strength between SnAgCu-xNi solder and Cu substrate during isothermal aging at 150 °C

Journal of Alloys and Compounds

Volumn 486, Issue 1-2, 2009, Pages 474-479

  Liu, Ping ^a,b   Yao, Pei ^a,c   Liu, Jim ^b  

^a TIANJIN UNIVERSITY   (China)

^b Motorola China Research Center   (China)

^c UNIVERSITY OF WOLLONGONG   (Australia)

Author keywords

Composite solders; Intermetallics (IM); Microstructure; Scanning electron microscopy (SEM); Sn3.8Ag0.7Cu

Indexed keywords

AGING TIME; BALL-SHEAR TEST; BULK SOLDER; COMPOSITE JOINT; COMPOSITE SOLDERS; CU SUBSTRATE; DIFFUSION COUPLE; FRACTURE MODE; IMC LAYER; INTERMETALLIC COMPOUNDS; ISOTHERMAL AGING; MIXED TYPE; NI PARTICLES; NON-COMPOSITE; ORGANIC SOLDERABILITY PRESERVATIVE; SN3.8AG0.7CU; SOLDER JOINTS; SQUARE ROOTS;

DUCTILE FRACTURE; JOINTS (STRUCTURAL COMPONENTS); MICROSTRUCTURE; NICKEL; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SOLDERING ALLOYS; SUBSTRATES; TIN;

BRITTLE FRACTURE;

EID: 70350126964     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.06.171     Document Type: Article

References (18)

1. Tu K.N., Gusak A.M., and Li M. J. Appl. Phys. 93 (2003) 1335
2. Suganuma K. Curr. Opin. Solid State Mater. Sci. 5 (2001) 55
3. Liu P., Yao P., and Liu J. J. Alloys Compd. 470 (2009) 188
4. Ahat S., Sheng M., and Luo L. J. Electron. Mater. 30 (2001) 1317
5. Lee H.T., and Lee Y.H. Sci. Technol. Weld. Joining 10 (2005) 353
6. Lee H.T., and Lee Y.H. Mater. Sci. Eng. A 419 (2006) 172
7. Chuang C.M., Shih P.C., and Lin K.L. J. Electron. Mater. 33 (2004) 1
8. Lee J.G., Chen K.C., and Subramanian K.N. J. Electron. Mater. 32 (2003) 1240
9. Lee Y.H., and Lee H.T. Mater. Sci. Eng. A 444 (2007) 75
10. Yao P., Liu P., and Liu J. J. Alloys Compd. 462 (2008) 73
11. Tu K.N., and Thompson R.D. Acta Mater. 30 (1982) 947
12. Hwang C.W., Lee J.G., Suganuma K., and Mori H. J. Electron. Mater. 32 (2003) 52
13. Gao F., Takemoto T., and Nishikawa H. Mater. Sci. Eng. A 420 (2006) 39
14. Laurila T., Vuorinen V., and Kivilahti J.K. Mater. Sci. Eng. R49 1-2 (2005) 1
15. Lee H.T., and Chen M.H. Mater. Sci. Eng. A 333 (2002) 24
16. Deng X., Sidhu R.S., Johnson P., and Chawla N. Metall. Mater. Trans. 36A (2005) 55
17. Kim S., Yoon J.W., and Jung S.B. J. Electron. Mater. 33 (2004) 1182
18. Yao P., Liu P., and Liu J. Microelectron. Eng 86 (2009) 1969