Interfacial reactions between Sn-8Zn-3Bi-xAg lead-free solders and Cu substrate

Journal of Alloys and Compounds

Volumn 482, Issue 1-2, 2009, Pages 90-98

  Liu, Lijuan ^a,b   Zhou, Wei ^a,b   Li, Baoling ^a,b   Wu, Ping ^a,b  

^a TIANJIN UNIVERSITY   (China)

^b Tianjin Key Laboratory of Low Dimensional Materials Physics and Preparing Technology   (China)

Author keywords

Ag addition; Interfacial reaction; Intermetallic compound

Indexed keywords

AG ADDITION; CU SUBSTRATE; DIFFUSION MECHANISMS; IMC LAYER; INTERFACIAL REACTION; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUND; INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; SN-8ZN-3BI; SOLDERING PROCESS;

BISMUTH COMPOUNDS; BRAZING; COPPER COMPOUNDS; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN; WELDING; ZINC;

LEAD;

EID: 67349090031     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.04.003     Document Type: Article

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