Overview on fabrication of three-dimensional structures in multi-layer ceramic substrate

Journal of the European Ceramic Society

Volumn 30, Issue 10, 2010, Pages 1973-1987

  Khoong, L E ^a   Tan, Y M ^a   Lam, Y C ^a,b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

A. Sintering; E. Substrate; Lamination; LTCC; Patterning

Indexed keywords

CERAMIC SUBSTRATES; CO-FIRING; E. SUBSTRATE; E. SUBSTRATES; INTRINSIC NATURE; MECHANICAL INTEGRITY; STATE OF THE ART; SUSPENDED STRUCTURE; THREE-DIMENSIONAL STRUCTURE;

CERAMIC MATERIALS; FABRICATION; LAMINATING; SINTERING; SUBSTRATES; THREE DIMENSIONAL;

DIMENSIONAL STABILITY;

EID: 77952958876     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jeurceramsoc.2010.03.011     Document Type: Review

References (58)

1. Gongora-Rubio M.R., Espinoza-Vallejos P., Sola-Laguna L., Santiago-Aviles J.J. Overview of low temperature co-fired ceramics tape technology for meso-system technology (MsST). Sens Actuat A: Phys 2001, 89:222-241.
2. Golonka L.J. Technology and applications of low temperature cofired ceramic (LTCC) based sensors and microsystems. Bull Pol Acad Sci Tech Sci 2006, 54:221-231.
3. Peterson K.A., Patel K.D., Ho C.K., Rohde S.B., Nordquist C.D., Walker C.A., et al. Novel microsystem applications with new techniques in low-temperature co-fired ceramics. Int J Appl Ceram Tech 2005, 2:345-363.
4. Ibanez-Garcia N., Martinez-Cisneros C.S., Valdes F., Alonso J. Green-tape ceramics. New technological approach for integrating electronics and fluidic in microsystems. Trends Anal Chem 2008, 27:24-33.
5. Lamminen A.E.I., Saily J., Vimpari A.R. 60-GHz patch antennas and arrays on LTCC with embedded-cavity substrates. IEEE Trans Antenn Propag 2008, 56:2865-2874.
6. Komulainen M., Mahonen J., Tick J., Berg T., Jantunen M., Henry H., et al. Embedded air cavity backed microstrip antenna on an LTCC substrate. J Eur Ceram Soc 2007, 27:2881-2885.
7. Yoshiniko I. Multilayered low temperature cofired ceramics technology 2005, Springer, US.
8. Khoong L.E., Tan Y.M., Lam Y.C. Study of deformation and porosity evolution of low temperature co-fired ceramic for embedded structure fabrication. J Eur Ceram Soc 2009, 29:2737-2745.
9. Bauer, R., Luniak, M., Rebenklau, L., Wolter, K. -J., Sauer, W., Realization of LTCC-multilayer with special cavity applications, 30th international symposium on microelectronics, ISHM'97, 1997; 659-664.
10. Malecha K., Golonka L.J. Microchannel fabrication process in LTCC ceramics. Microelectron Reliab 2008, 48:866-871.
11. Bau H., Ananthasuresh S., Santiago-Aviles J.J., Zhong J., Kim M., Yi M., et al. Ceramic tape based meso systems technology. Proceedings of the ASME international mechanical engineering congress and exposition 1988, 491-498.
12. Yau Y.-W., Long C.D., Grant W.T. Overview of via formation technologies for ceramic packaging manufacturing. IEEE 1993, 155-158.
13. Natarajan G., Humenik J.N. 3D ceramic microfluidic device manufacturing. J Phys: Conf Series 2006, 34:533-539.
14. Hagen G., Rebenklau L. Fabrication of smallest vias in LTCC tape. Electronic system integration technology conference 2006, 642-647.
15. Wang G., Folk E.C., Barlow F., Elshabini A. Fabrication of microvias for multilayer LTCC substrates. IEEE Trans Electron Pack 2006, 29:32-41.
16. Rhim S.H., Shin S.Y., Joo B.Y., Oh S.I. Burr formation during micro via-hole punching process of ceramic and PET double layer sheet. Int J Adv Manuf Technol 2006, 30:227-232.
17. Moeller K., Besecker J., Hampikian G., Moll A., Plumlee D., Youngsman J., et al. A prototype continuous flow polymerase chain reaction LTCC device. Mater Sci Forum 2007, 539-543:523-528.
18. Kita J., Dziedzic A., Golonka L.J., Zawada T. Laser treatment of LTCC for 3D structures and elements fabrication. Microelectron Int 2002, 19:14-18.
19. 2 laser. Appl Phys A 2006, 84:267-270.
20. Zhu J., Yung W.K.C. Studies on laser ablation of low temperature co-fired ceramics (LTCC). Int J Adv Manuf Technol 2009, 42:696-702.
21. Kita J., Dziedzic A., Golonka L.J., Bochenek A. Properties of laser cut LTCC heaters. Microelectron Reliab 2000, 40:1005-1010.
22. Smetana W., Balluch B., Stangl G., Luftl S., Seidler S. Processing procedures for the realization of fine structured channel arrays and bridging elements by LTCC-technology. Microelectron Reliab 2009, 49:592-599.
23. Rabe T., Kuchenbecker P., Schulz B. Hot embossing: an alternative method to produce cavities in ceramic multilayer. Int J Appl Ceram Tech 2007, 4:38-46.
24. Andrijasevic D., Smetana W., Zehetner J., Zoppel S., Brenner W. Aspect of micro structuring low temperature co-fired ceramic (LTCC) for realisation complex 3D objects by embossing. Microelectron Eng 2007, 84:1198-1201.
25. Shan X.-C., Maw H.P., Tjeung R.T., Ling S.H., Lu C.W., Jachowicz R. Microstructure formation on low temperature co-fired ceramic green substrates using micro embossing. Microsyst Technol 2008, 14:1405-1409.
26. Shan X.-C., Soh Y.C., Shi C.W.P., Tay C.K., Chua K.M., Lu C.W. Large-area patterning of multilayered green ceramic substrates using micro roller embossing. J Micromech Microeng 2008, 18:065007.1-065007.8.
27. Espinoza-Vallejos P., Santiago-aviles J. Photolithographic feature fabrication in LTCC. Int J Microcircuits Electron Pack 2000, 23:286-292.
28. Park J., Espinoza-Vallejos P., Sola-Laguna L., Santiago-Aviles J. Etching and exfoliation techniques for the fabrication of 3-D meso-scales structures on LTCC tapes. International symposium on microelectronics, vol. 3582 1988, 121-126.
29. Miehls, D. J., Martin, F. J., Pond, R. G., Fleischner, P. S., Method of fabricating a multilayer electrical circuit, US Patent No. 5,249,355; 1993.
30. Cawley, J. D., Heuer, A. H., Newman, W. S., Method of constructing three dimensional bodies from lamination. US Patent No. 5,777,833; 1998.
31. Kuo, J. -I., Da, S. -J., Lamination process of packaging substrate, US Patent Application Publication No. 2004/0108058 A1; 2004.
32. Trickett, E. A., Assmus, R. C., Ceramic monolithic structure having an internal cavity contained therein and a method of preparing the same, US Patent No. 4,806,295; 1989.
33. Smith, B. R., Pike, R. T., Newton, R. T., Embedded hermetic cavity formation in low temperature cofired ceramic, US Patent No. 6,733,607 B2; 2004.
34. Malecha K., Jurkow D., Golonka L.J. Comparison of solvent and sacrificial volume-material-based lamination processes of low-temperature co-fired ceramics tapes. J Micromech Microeng 2009, 19:065022.1-165022.1.
35. Wilcox D.L., Burdon J.M., Changrani R., Chou C.-F., Dai S., Koripella R., et al. Add ceramic " MEMS" to the pallet of Microsystems technologies. Mater Res Soc Symp Proc 2002, 687:B7.1.1-B7.1.18.
36. Alexander, J. H., Method of making ceramic article with cavity using LTCC tape, US patent No. 5,601,673; 1997.
37. Peterson K.A., Rohde S.B., Walker C.A., Patel K.D., Turner T.S., Nordquist C.D. Microsystem integration with new techniques in LTCC. Proceedings of the ceramic interconnect technology conference 2004, 19-26.
38. Epsinoza-Vallejos P., Zhong J.-H., Gongora-Rubio M.R., Sola-laguna L., Santiago-Aviles J.J. Meso (intermediate)-scale electromechanical systems for the measurement and control of sagging in LTCC structures. Mater Res Soc Symp Proc 1998, 518:3-79.
39. Birol H., Maeder T., Corradini J.G., Passerini R., Fournier Y., Straessler S., et al. Fabrication of LTCC micro-fluidic devices using sacrificial carbon layers. Int J Appl Ceram Tech 2005, 2:364-371.
40. Birol H., Maeder T., Ryser P. Processing of graphite-based sacrificial layer for microfabrication of low temperature co-fired ceramics (LTCC). Sens Actuat A: Phys 2006, 130-131:560-567.
41. Birol H., Maeder T., Ryser P. Application of graphite-based sacrificial layers for fabrication of LTCC (low temperature co-fired ceramic) membranes and micro-channel. J Micromech Microeng 2007, 50-60.
42. Khoong L.E., Tan Y.M., Lam Y.C. Carbon burnout and densification of self-constrained LTCC for fabrication of embedded structures in a multi-layer platform. J Eur Ceram Soc 2009, 29:457-463.
43. Newborn C.H., English J.M., Coe D.J. LTCC fabrication for a leaf spring vertical actuator. Int J Appl Ceram Tech 2006, 3:61-67.
44. Fournier Y., Triverio O., Maedar T., Ryser P. LTCC free-standing structures with mineral sacrificial paste. Proceedings of ceramic interconnect and ceramic microsystems technologies, Munich (DE) 2008, 11-18.
45. Piwonski M.A., Roosen A. Low pressure lamination of ceramic green tapes by gluing at room temperature. J Eur Ceram Soc 1999, 19:263-270.
46. Roosen A. New lamination technique to join ceramic green tapes for the manufacturing of multilayer devices. J Eur Ceram Soc 2001, 21:1993-1996.
47. Burdon, J. W., Huang, R. -F., Wilcox, D., Naclerio, N. J., Method for fabricating a multilayered structure and the structures formed by the method. US Patent 6,592,696; 2003.
48. Schindler K., Roosen A. Manufacture of 3D structures by cold low pressure lamination of ceramic green tapes. J Eur Ceram Soc 2009, 29:899-904.
49. Sadler D.J., Changrani R., Roberts P., Chou C.-F., Zenhausern F. Thermal management of BioMEMS: temperature control for ceramic-based PCR and DNA detection devices. IEEE Trans Compon Pack Technol 2003, 26:309-316.
50. Panther A., Petosa A., Stubbs M.G., Kautio K. A wideband array of stacked patch antennas using embedded air cavities in LTCC. IEEE Microw Wirel Co 2005, 15:916-918.
51. Rocha Z.M., Ibanez Garcia N., Oliveira N.A., Matos J., Rosario D., Gongora-Rubio M.R. Low temperature and pressure lamination of LTCC tapes for meso-systems. Proceedings of IMAPS conference and exhibition on ceramic interconnect technology 2004.
52. Jurkow D., Roguszczak H., Golonka L. Cold chemical lamination of ceramic tapes. J Eur Ceram Soc 2009, 21:703-709.
53. Jacobson R. Y., Gupta, T. K., Method of fabricating structures using low temperature cofired ceramics, US Patent No. 7,204,900 B1; 2007.
54. Berry, C. W., Bailey, A. E., Method of laminating low temperature cofired (LTCC) material, US Patent No. 7,240,424 B2; 2007.
55. Barlow F., Wood J., Elshabini A., Stephens E.F., Feeler R., Kemner G., et al. Fabrication of precise fluidic structures in LTCC. Int J Appl Ceram Tech 2009, 6:18-23.
56. Kim J.G., Lee E.T., Kim D.H., Lee J.H., Lee S.Y., Kim H.S., et al. Analysis of coupling characteristics between transmission lines with buried meshed-ground in LTCC-MCMs. IEEE MTT-S Int Microwave Symp Digest 2002, 2:825-828.
57. Wahlers R.L., Stein S.J., Stein M.A., Feingold A.H., Bless P.W. Ceramic tapes for wireless applications 2000, ACerS, St. Louis, MO.
58. Yamamoto R.K., Gongora-Rubio M.R., Pessoa R.S., Cunha M.R., Maciel H.S. Mixed LTCC and LTTT technology for microplasma generator fabrication. J Microelectron Electron Pack 2009, 6:1-7.