Burr formation during micro via-hole punching process of ceramic and PET double layer sheet

International Journal of Advanced Manufacturing Technology

Volumn 30, Issue 3-4, 2006, Pages 227-232

  Rhim, S H ^a   Shin, S Y ^b   Joo, B Y ^b   Oh, S I ^b  

^a Seoul National University   (South Korea)

^b Seoul National University   (South Korea)

Author keywords

Burr formation; Double layer sheet; Low temperature co fired ceramic(LTCC); Shear fracture behavior; Via hole

Indexed keywords

CERAMIC MATERIALS; ELECTRONIC EQUIPMENT; FRACTURE; POLYETHYLENE TEREPHTHALATES; SINTERING;

BURR FORMATION; DOUBLE LAYER SHEETS; LOW TEMPERATURE CO-FIRED CERAMICS (LTCC); SHEAR FRACTURE BEHAVIOR; VIA HOLE;

PUNCHING;

EID: 33746862052     PISSN: 02683768     EISSN: 14333015     Source Type: Journal    
DOI: 10.1007/s00170-005-0058-1     Document Type: Article

References (7)

1. Wang Y, Zhang G, Ma J (2002) Research of LTCC/Cu, ag multilayer substrate in microelectronic packaging. Mater Sci Eng 94:48-53
2. Gongora-Rubio MR, Espinoza-Vallejos P, Sola-Laguna L, Santiago-Avilés JJ (2002) Overview of low temperature cofired ceramics tape technology for meso-system technology (MsST). Sens Actuators, A, Phys 89:222-241
3. Joo BY, Oh SI, Jeon BH (2001) Development of micro punching system. CIRP Ann 50:191-194
4. Lange K (1985) Blanking and piercing, handbook of metal forming. The McGraw-Hill Book Company, pp 243-2442
5. Davies R, Dhawan SM (1967) Further developments in high speed blanking of Metals. Proceedings of the 7th MTDR conference, Birmingham, pp 67-79
6. Lange K, Liebing H. (1978) Blanking and piercing without any burr. CIRP Ann 27:177-181
7. Li M (2000) Micromechanisms of deformation and fracture in shearing aluminum alloy sheet Int J Mech Sci 907-923