Fabrication of microvias for multilayer LTCC substrates

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 29, Issue 1, 2006, Pages 32-41

  Wang, Gangqiang ^a   Folk, Erica C ^a,b   Barlow, Fred ^a   Elshabini, Aicha ^a  

^a University of Arkansas   (United States)

^b NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

High density interconnect; Laser drill; Low temperature cofired ceramic (LTCC); Mechanical punch; Microvias; Via fill

Indexed keywords

ADHESIVE PASTES; ALIGNMENT; METALLIZING; MULTILAYERS; PUNCHING; SCREEN PRINTING; SEMICONDUCTOR DEVICE MANUFACTURE; SUBSTRATES;

LOW-TEMPERATURE COFIRED CERAMIC; MICROVIA TECHNOLOGIES; PHOTOIMAGEABLE TECHNIQUES;

MICROELECTRONIC PROCESSING;

EID: 32144441318     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2005.862633     Document Type: Article

References (7)

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