Processing procedures for the realization of fine structured channel arrays and bridging elements by LTCC-Technology

Microelectronics Reliability

Volumn 49, Issue 6, 2009, Pages 592-599

  Smetana, Walter ^a   Balluch, Bruno ^a,b   Stangl, Günther ^a   Lüftl, Sigrid ^a   Seidler, Sabine ^a  

^a VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

^b OnkoTec GmbH   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC TAPES; CHANNEL ARRAYS; CHANNEL WIDTHS; FIRING PROCESS; FLUIDIC HEAT EXCHANGERS; FUNCTIONAL PARTS; LASER MICRO-MACHINING; LOW-TEMPERATURE CO-FIRED CERAMICS; MICRO-FLUIDIC DEVICES; OPTICAL INSPECTIONS; ORGANICS; PARTITION WALLS; PROCESSING PROCEDURES; PROCESSING STEPS; SENSOR SUBSTRATES; SINGLE LAYERS; THERMAL MASS; YAG LASERS;

BIODEGRADABLE POLYMERS; CERAMIC MATERIALS; OPTICAL TESTING; TAPES;

THERMAL INSULATION;

EID: 65649096613     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.02.023     Document Type: Article

References (15)

1. Müller J, Perrone R, Rentsch S, Hintz M, Stephan R. Improved RF performance for embedded passives in LTCC by fine line structuring methods. In: Proceedings of the 30th international conference of IMAPS, Cracow, Poland; 2006. p. 69-77.
2. Gongora-Rubio M.R., Espinoza-Vallejos P., Sola-Laguna L., and Santiago-Aviles J.J. Overview of low temperature cofired ceramics tape technology for meso-system technology (MsST). Sensors Actuat A 89 (2001) 222-241
3. Feingold AH, Heinz M, Wahlers RL. Dielectric and magnetic materials for integrated passives. In: Proceedings of the ceramic interconnect technology, Denver, USA; 2003. p. 189-94.
4. Golonka L.J. Technology and applications of low temperature cofired ceramic (LTCC) based sensors and microsystems. Bull Pol Acad: Tech 54 2 (2006) 221-231
5. Smetana W., Balluch B., Stangl G., Gaubitzer E., Edetsberger M., and Köhler G. A multi-sensor biological monitoring module built up in LTCC-technology. Microelectron Eng 84 5-8 (2007) 1240-1243
6. Andrijasevic D, Smetana W, Zoppel S, Brenner W. An investigation on development of MEMS in LTCC by embossing technique. In: 4M 2007 - third international conference on multi-material micro manufacture - proceedings, Borovets, Bulgaria; 2007. p. 143-6.
7. Wolter KJ, et at. Via formation in LTCC tape: a comparison of technologies. In: Proceedings of the ACerS/IMAPS 1st international conference on ceramic interconnect and ceramic microsystems technologies, Baltimore, USA; 2005.
8. Smetana W., Balluch B., Stangl G., Gaubitzer E., Edetsberger M., and Köhler G. Set-up of a biological monitoring module realized in LTCC technology. Proc SPIE 6465 (2007) 646509-1-646509-10
9. Jaques B, Weston H, Plumlee DG, Moll AJ. Advanced fabrication techniques for an ion mobility spectrometer for low-temperature co-fired ceramics. In: Proceedings of the IMAPS/ACerS 2nd international conference and exhibition on ceramic interconnect and ceramic microsystems technologies, Denver, USA; 2006.
10. Wang XS, Balluch B, Smetana W, Stangl G. Optimization of LTCC-channel fabrication for biomedical micro fluidic 3D-structures. In: Proceedings of the 31th international spring seminar on electronics technology, Budapest, Hungary; 2008. p. 420-5.
11. Birol H., Maeder T., and Ryser P. Processing of graphite-based sacrificial layer for microfabrication of low temperature co-fired ceramics (LTCC). Sensors Actuat A 130-131 (2006) 560-567
12. Birol H., Maeder T., Jacq C., Straessler S., and Ryser P. Fabrication of LTCC micro-fluidic devices using sacrificial carbon layers. Int J Appl Ceramic Technol 2 5 (2005) 345-354
13. Youngsmann J, Marx B, Schimpf M, Wolter S, Glass J, Moll A. Low temperature co-fired ceramics for micro-fluidics. In: 56th Electronic components and technology Conference 2006, San Diego, CA; 2006. p. 699-704.
14. Malecha K, Golonka LJ. Microchannel fabrication process in LTCC ceramics. In: Proceedings of the 31th international conference of IMAPS, Rzeszow-Krasiczyn, Poland; 2007.
15. Piwonski A.M., and Roosen A. Low pressure lamination of ceramic green tapes by gluing at room temperature. J Eur Ceramic Soc 19 2 (1999) 263-270