메뉴 건너뛰기




Volumn 27, Issue 8-9 SPEC. ISS., 2007, Pages 2881-2885

Embedded air cavity backed microstrip antenna on an LTCC substrate

Author keywords

Embedded air cavity

Indexed keywords

BANDWIDTH; BROADBAND NETWORKS; CAVITY RESONATORS; PERMITTIVITY; SUBSTRATES; TELECOMMUNICATION NETWORKS;

EID: 33947650694     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jeurceramsoc.2006.11.012     Document Type: Article
Times cited : (21)

References (12)
  • 4
    • 33645907540 scopus 로고    scopus 로고
    • Design of new three-line balun and its implementation using multilayer configuration
    • Lee B.H., Park D.S., Park S.S., and Park M.C. Design of new three-line balun and its implementation using multilayer configuration. IEEE Trans. Microwave Theory Tech. 54 (2006) 1405-1414
    • (2006) IEEE Trans. Microwave Theory Tech. , vol.54 , pp. 1405-1414
    • Lee, B.H.1    Park, D.S.2    Park, S.S.3    Park, M.C.4
  • 6
    • 9244227613 scopus 로고    scopus 로고
    • Design of compact stacked-patch antennas in LTCC multilayer packaging modules for wireless applications
    • Li R., DeJean G., Maeng M., Lim K., Pinel S., Tentzeris M.M., et al. Design of compact stacked-patch antennas in LTCC multilayer packaging modules for wireless applications. IEEE Trans. Adv. Pack. 27 (2004) 581-589
    • (2004) IEEE Trans. Adv. Pack. , vol.27 , pp. 581-589
    • Li, R.1    DeJean, G.2    Maeng, M.3    Lim, K.4    Pinel, S.5    Tentzeris, M.M.6
  • 7
    • 18944397985 scopus 로고    scopus 로고
    • 60-GHz multilayer parasitic microstrip array antenna on LTCC substrate for system-on-package
    • Seki T., Honma N., Nishikawa K., and Tsunekawa K.A. 60-GHz multilayer parasitic microstrip array antenna on LTCC substrate for system-on-package. IEEE Microwave Wireless Comp. Lett. 15 (2005) 339-341
    • (2005) IEEE Microwave Wireless Comp. Lett. , vol.15 , pp. 339-341
    • Seki, T.1    Honma, N.2    Nishikawa, K.3    Tsunekawa, K.A.4
  • 8
    • 0026630618 scopus 로고
    • Microstrip antennas
    • Pozar D.M. Microstrip antennas. Proc. IEEE 80 (1992) 79-91
    • (1992) Proc. IEEE , vol.80 , pp. 79-91
    • Pozar, D.M.1
  • 11
    • 3142781354 scopus 로고    scopus 로고
    • An additive micromolding approach for the development of micromachined ceramic substrates for RF application
    • Vaed K., Akbar S.A., Madou M.J., Lannutti J.J., and Cahill S.S. An additive micromolding approach for the development of micromachined ceramic substrates for RF application. IEEE J. Microelectromech. Syst. 13 (2004) 514-525
    • (2004) IEEE J. Microelectromech. Syst. , vol.13 , pp. 514-525
    • Vaed, K.1    Akbar, S.A.2    Madou, M.J.3    Lannutti, J.J.4    Cahill, S.S.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.