Fabrication of smallest vias in LTCC tape

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 1, Issue , 2006, Pages 642-647

  Hagen, Gunter ^a   Rebenklau, Lars ^b  

^a KMS Kemmer Technology Center GmbH   (Germany)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; INTERCONNECTION NETWORKS; PRODUCT DEVELOPMENT; PRODUCTION CONTROL; SEMICONDUCTOR JUNCTIONS;

CERAMIC INTERCONNECTIONS; ELECTRONIC PRODUCTS; JUNCTION INTEGRATION; MINIATURIZATION;

ELECTRONIC EQUIPMENT;

EID: 42549096011     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280072     Document Type: Conference Paper

References (8)

1. IMAPS - Ceramic Interconnect Initiative (CII) 2004 Technology Roadmap (Also presented by iNEMI as the Technology Roadmap for Ceramic Interconnects)
2. nd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Denver, CO, April 2006
3. th International Symposium on Microelectronics, Philadelphia, PA, Sept. 2005
4. th International Symposium on Microelectronics, Long Beach, CA, Nov. 2004
5. st International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, Baltimore, MD, April 2005
6. Meier, D. et al, "PCB Laser Technology for Rigid and Flex HDI - Via Formation, Structuring, Routing", presented at IPC Printed Circuits Expo 2002
7. th European Microelectronics and Packaging Conference & Exhibition, Friedrichshafen, Germany, June 2003
8. Drüe, K.-H., "Precise Drilling and Structuring f LTCC Materials using a 355 nm YAG-Laser", EMPC 2005, Brugge, Belgium, June 2005