Efficient extraction of thin-film thermal parameters from numerical models via parametric model order reduction

Journal of Micromechanics and Microengineering

Volumn 20, Issue 4, 2010, Pages

  Bechtold, T ^a,b   Hohlfeld, D ^c   Rudnyi, E B ^d   Gunther M ^b  

^a NXP SEMICONDUCTORS   (Netherlands)

^b UNIVERSITY OF WUPPERTAL   (Germany)

^c HOLST CENTRE   (Netherlands)

^d CADFEM GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT MODELS; FULL-SCALE MODELS; MATERIAL PROPERTY; MEASUREMENT RESULTS; NUMERICAL MODELS; OPTIMIZATION PROBLEMS; ORDERS OF MAGNITUDE; PARAMETERIZED; PARAMETRIC MODELS; REDUCED ORDER MODELS; THERMAL PARAMETERS; THERMAL PROPERTIES; TRANSIENT SOLUTIONS;

AMORPHOUS FILMS; FINITE ELEMENT METHOD; MATERIALS PROPERTIES; SILICON NITRIDE; SILICON OXIDES; THERMODYNAMIC PROPERTIES; THIN FILM DEVICES;

AMORPHOUS SILICON;

EID: 77949883865     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/4/045030     Document Type: Article

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