Fast simulation of steady-state temperature distributions in electronic components using multidimensional model reduction

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 1, 2005, Pages 70-79

  Celo, Dritan ^a   Gunupudi, Pavan K ^a   Khazaka, Roni ^b   Walkey, David J ^a   Smy, Tom ^a   Nakhla, Michel S ^a  

^a CARLETON UNIVERSITY   (Canada)

^b MCGILL UNIVERSITY   (Canada)

Author keywords

C4 CBGA package; Compact modeling; GaN MESFET; Integrated circuit (IC) component; Multidimensional model reduction; Silicon on insulator (SOI) clock driver; Thermal analysis

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; MESFET DEVICES; PARTIAL DIFFERENTIAL EQUATIONS; POWER AMPLIFIERS; SILICON ON INSULATOR TECHNOLOGY; TEMPERATURE DISTRIBUTION; THERMOANALYSIS; THERMODYNAMICS;

COMPACT MODELING; GALLIUM NITRIDE MESFET; INTEGRATED CIRCUIT (IC) COMPONENT; MULTIDIMENSIONAL MODEL REDUCTION; SILICON ON INSULATOR (SOI) CLOCK DRIVER;

ELECTRONICS PACKAGING;

EID: 15744401613     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.838877     Document Type: Article

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