Process-dependent thin-film thermal conductivities for thermal CMOS MEMS

Journal of Microelectromechanical Systems

Volumn 9, Issue 1, 2000, Pages 136-145

  Von Martin, Arx ^a   Paul, Oliver ^b   Baltes, Henry ^c  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b UNIVERSITY OF FREIBURG   (Germany)

^c ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ATMOSPHERIC PRESSURE; BOROSILICATE GLASS; CMOS INTEGRATED CIRCUITS; CONDUCTIVE FILMS; DIELECTRIC FILMS; FUSED SILICA; MICROELECTROMECHANICAL DEVICES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SEMICONDUCTING SILICON COMPOUNDS; TEMPERATURE; THERMAL CONDUCTIVITY OF SOLIDS;

ATMOSPHERIC PRESSURE CHEMICAL VAPOR DEPOSITION; BOROPHOSPO SILICATE GLASSES; LOW PRESSURE CHEMICAL VAPOR DEPOSITION; PHOSPHO SILICATE GLASSES; THIN FILM METAL; THIN FILM POLYSILICON; WIEDEMANN-FRANZ LAW;

THIN FILMS;

EID: 0343193098     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.825788     Document Type: Article

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